Packaging method and packaging structure thereof
A technology of packaging structure and packaging method, applied in the direction of coupling of optical waveguides, can solve problems such as affecting the transmission quality of optical communication links and increasing coupling loss, etc.
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[0031] In order to make the technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0032] The term "optical device" as used in the following description may include structures of active and passive devices with light-conducting media, including but not limited to integrated optoelectronic chips, silicon-based optoelectronic chips, silicon-based optical waveguides, optoelectronic Chips, optical switches, optical waveguides, multimode interference (MMI) optical couplers, optical filters, and optical modulators.
[0033] In the design of an integrated optoelectronic chip, there are usually multiple different optical devices that need to be connected. A typical situation is that two different optical devices need to be connected alternately, resulting in multiple coupling interfaces that...
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