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Surface modification method and application of silicon dioxide

A surface modification and silicon dioxide technology, applied in the field of chemical engineering, can solve problems such as the decrease of elastic modulus, the increase of the viscosity of packaging materials, and the increase of thermal expansion coefficient, so as to reduce the thermal expansion coefficient and viscosity, increase the elastic modulus, and aromatic The effect of high ring rigidity

Active Publication Date: 2022-04-01
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] b) Epoxy modification of silica micropowder with alicyclic epoxy modifier, the performance of the packaging material is partially improved, but there is still an increase in thermal expansion coefficient and a decrease in elastic modulus, which will occur in the case of high grafting rate lead to an increase in the viscosity of the encapsulation material

Method used

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  • Surface modification method and application of silicon dioxide
  • Surface modification method and application of silicon dioxide

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] In the present embodiment, the modification process of silica is as follows:

[0048] 1) Preheat 1 kg of silica powder with an average particle size of 500 nanometers at 180°C for 3 hours in vacuum;

[0049] 2) Spray 20g of trimethoxy ({[4-(epoxy-2-yl)phenyl]methyl})silane on the silica powder in the form of a spray at room temperature;

[0050] 3) Stir at 115° C. at a high speed of 600 rpm for 60 minutes to obtain epoxy-modified silicon dioxide micropowder.

[0051] Effect test:

[0052] ①Add the above-mentioned epoxy-modified silica powder into the bisphenol A epoxy resin, the mass ratio is 5:3, mix evenly and defoam in the mixer at 2000 rpm and vacuum condition, use Rheometer test room temperature viscosity (shear rate 50 / second);

[0053] ②Add the above-mentioned epoxy-modified silica powder to bisphenol A epoxy resin containing curing agent, the mass ratio of epoxy-modified silica powder to bisphenol A epoxy resin is 5:3, The quality of the curing agent is 25% ...

Embodiment 2

[0055] In the present embodiment, the modification process of silica is as follows:

[0056] 1) Preheat 1 kg of silica powder with an average particle size of 500 nanometers at 180°C for 3 hours in vacuum;

[0057] 2) Spray 20g of ({4-[2-(oxirane-2-yl)ethyl]phenyl}methyl)silane on the silica powder in the form of a spray at room temperature;

[0058] 3) Stir at 115° C. at a high speed of 600 rpm for 60 minutes to obtain epoxy-modified silicon dioxide micropowder.

[0059] Effect test:

[0060] ①Mix the above-mentioned epoxy-modified silica powder and bisphenol A epoxy resin according to the mass ratio of 5:3, mix them evenly in a mixer at 2000 rpm and vacuum conditions, and defoam them, and test them with a rheometer Viscosity at room temperature (shear rate 50 / sec);

[0061] ②Add the above-mentioned epoxy-modified silica powder to bisphenol A epoxy resin containing curing agent, the mass ratio of epoxy-modified silica powder to bisphenol A epoxy resin is 5:3, The quality of...

Embodiment 3

[0063] In the present embodiment, the modification process of silicon dioxide is as follows:

[0064] 1) Preheat 1 kg of silica powder with an average particle size of 500 nanometers at 180°C for 3 hours in vacuum;

[0065] 2) Spray 20g of trimethoxy ({4-[(epoxy-2-oxyl)methyl]phenyl}methyl)silane on the silica powder in the form of a spray at room temperature;

[0066] 3) Stir at 115° C. at a high speed of 600 rpm for 60 minutes to obtain epoxy-modified silicon dioxide micropowder.

[0067] Effect test:

[0068] ①Mix the above-mentioned epoxy-modified silica powder and bisphenol A epoxy resin according to the mass ratio of 5:3, mix them evenly in a mixer at 2000 rpm and vacuum conditions, and defoam them, and test them with a rheometer Viscosity at room temperature (shear rate 50 / sec);

[0069] ②Add the above-mentioned epoxy-modified silica powder to bisphenol A epoxy resin containing curing agent, the mass ratio of epoxy-modified silica powder to bisphenol A epoxy resin is...

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Abstract

The invention discloses a surface modification method and application of silicon dioxide. The modified silicon dioxide is obtained by carrying out surface grafting modification on silicon dioxide by adopting an epoxy silane modifier containing an aromatic ring. The invention also discloses an epoxy resin composition containing the modified silicon dioxide. According to the epoxy silane containing the aromatic ring, due to the fact that the aromatic ring in the silane structure is large in rigidity and small in molecular motility, in the electronic packaging process, modified silicon dioxide is added into epoxy resin, the thermal expansion coefficient and viscosity of the packaging material can be reduced, and the elastic modulus can be increased.

Description

technical field [0001] The invention relates to the technical field of chemical engineering, in particular to a surface modification method and application of silicon dioxide. Background technique [0002] Due to its low thermal expansion coefficient, good thermal stability and chemical stability, silica fillers are widely used in the fields of electronic packaging materials such as underfill adhesives, epoxy molding compounds, and insulating adhesive films. The thermal expansion coefficient of the resin material added with silica filler decreases with the increase of silica filling amount, but the silica filler without surface modification is easy to be caused by the cohesion between fillers and filler The poor compatibility with the resin leads to the increase of the viscosity of the system and the phenomenon of delamination, which leads to the failure of the packaging material. In order to reduce the cohesion between silica fillers and improve the interfacial compatibili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C1/30C09C3/12C08L63/00C08K9/06C08K3/36
Inventor 王宁朱朋莉赵涛孙蓉杜明勇杜晓蒙张磊聪杨柳
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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