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Double-color LED and manufacturing process thereof

A LED chip and two-color technology, applied in electrical components, electric solid devices, circuits, etc., can solve the problems affecting the uniformity of light output and inconsistent light spots, and achieve the effect of good light spot consistency and uniform light output

Pending Publication Date: 2022-03-22
HONGLI ZHIHUI GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the different thickness of the fluorescent adhesive layer of this kind of double-color LED, the light spots are inconsistent, which affects the uniformity of light output; in addition, the fluorescent adhesive layer is formed by dispensing process. If the distance between adjacent LED chips is small, the fluorescent adhesive is easy to touch the side Adjacent chips, so it is not suitable for densely integrated two-color COB

Method used

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  • Double-color LED and manufacturing process thereof
  • Double-color LED and manufacturing process thereof

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with the accompanying drawings of the description.

[0024] Such as figure 1 As shown, a two-color LED includes a substrate 1, an LED chip disposed in a die-bonding area of ​​the substrate 1, and a cofferdam 2 arranged around the die-bonding area. The LED chips include a first LED chip 3 and a second LED chip 4, the first LED chip 3 and the second LED chip 4 are blue light flip chips, the first LED chip 3 and the second LED chip 4 are surrounded by The interior of the weir 2 is arranged in a dislocation manner at intervals, and the distance between the first LED chip 3 and the second LED chip 4 is 0.30-0.35 mm. The top light-emitting surface of the first LED chip 3 is provided with a first transparent adhesive layer 5, and the first transparent adhesive layer 5 is provided with a first phosphor layer 6. The first LED chip 3, the first transparent The adhesive layer 5 and the first phosphor layer 6 fo...

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Abstract

The double-color LED comprises a substrate, LED chips arranged in a die bonding area of the substrate and a cofferdam arranged around the die bonding area, and the LED chips comprise a first LED chip and a second LED chip; a first transparent adhesive layer and a first fluorescent powder layer are arranged on the light-emitting surface of the top surface of the first LED chip to form a first color temperature LED, a second fluorescent powder layer is arranged on the light-emitting surface of the top surface of the second LED chip to form a second color temperature LED, and the height of the first fluorescent powder layer and the first transparent adhesive layer is the same as the height of the second fluorescent powder layer; a fluorescent glue layer is arranged on the side face of the LED chip in the cofferdam, the fluorescent glue layer covers the light-emitting face of the side face of the LED chip, and a second transparent glue layer covering the first color temperature LED, the second color temperature LED and the fluorescent glue layer is arranged in the cofferdam. The height of the first fluorescent powder layer and the first transparent adhesive layer is the same as the height of the second fluorescent powder layer, so that the light spot consistency of the first color temperature LED and the second color temperature LED is good, and the emergent light is uniform.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a two-color LED and a manufacturing process thereof. Background technique [0002] Traditional two-color COB generally includes a substrate, a first LED chip and a second LED chip. The light-emitting surface of the first LED chip is covered with the first fluorescent glue, and the light-emitting surface of the second LED chip is covered with the second fluorescent glue. Different thicknesses from the second fluorescent glue produce cool and warm color temperatures. Due to the different thickness of the fluorescent adhesive layer of this kind of double-color LED, the light spots are inconsistent, which affects the uniformity of light output; in addition, the fluorescent adhesive layer is formed by dispensing process. If the distance between adjacent LED chips is small, the fluorescent adhesive is easy to touch the side Adjacent chips, so it is not suitable for densely integrated two-color COB...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/50
CPCH01L25/0753H01L33/505H01L33/504H01L33/508H01L2933/0041
Inventor 刘萍萍尹键林德顺王跃飞翁平杨永发
Owner HONGLI ZHIHUI GRP CO LTD
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