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Thermal control structure and device for satellite-borne on-orbit information processing and service load

An on-board and payload technology, applied in the field of on-orbit information processing and thermal control structures and devices for serving payloads, can solve problems such as large temperature fluctuations and increased cost.

Active Publication Date: 2022-03-11
TECH & ENG CENT FOR SPACE UTILIZATION CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Existing products use heat pipes to achieve good conduction and heat dissipation. The equivalent thermal conductivity of heat pipes is more than 100 times that of ordinary metals, and has good thermal conductivity. There are also cramped structural size constraints, which put forward higher requirements for the working fluid and size of the heat pipe, and need to be customized according to the specific situation. If multiple heat pipes are used, the weight will increase, and the cost will also increase. If the heat conduction is too fast, it will Temperature-sensitive devices cause adverse effects of large temperature fluctuations

Method used

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  • Thermal control structure and device for satellite-borne on-orbit information processing and service load
  • Thermal control structure and device for satellite-borne on-orbit information processing and service load
  • Thermal control structure and device for satellite-borne on-orbit information processing and service load

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Embodiment Construction

[0045] The principles and features of the present invention are described below, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0046] Such as Figure 1-Figure 11 As shown, this embodiment provides a thermal control structure for spaceborne on-orbit information processing and service loads, including a box body 1, a power board 2 and a control board 3 installed in the box body 1, and components in the board The heat conducting board 301, the power board 2 and the control board 3 are arranged close to the top board and the bottom board of the box body 1 respectively, and the area of ​​the power board 2 is smaller than the control board 3, and the power board 2 and the One end side wall of the box body 1 is fixedly connected, and the middle part of the box body 1 has a device cooling part 101 in the board close to the control board 3, and one side of the device heat conducting plate 301 i...

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PUM

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Abstract

The invention relates to a thermal control structure and device for satellite-borne on-orbit information processing and service load, and relates to the field of mechanical thermal design, a power panel and a control panel are arranged close to a top plate and a bottom plate of a box body respectively, the area of the power panel is smaller than that of the control panel, and three side edges of the power panel are fixedly connected with three adjacent side walls at one end of the box body; the middle part of the box body is provided with an in-board device heat dissipation part close to the control board, one side of the in-board device heat conduction plate is fixedly connected with a large-size device in the middle of the top surface of the control board, and the other side of the in-board device heat conduction plate abuts against the in-board device heat dissipation part. The device has the beneficial effects that under weight constraint, size constraint, cost constraint and sensitive constraint of the device to temperature, heat of the device in the middle of the control panel is conducted to the device-in-plate heat dissipation part nearby through the device-in-plate heat conduction plate, the device-in-plate heat dissipation part conducts heat in a radiation mode, and the heat can also be conducted to a satellite top plate for heat exchange. Heat dissipation paths of devices in the middle of the control panel are shortened, heat dissipation efficiency is improved, and heat accumulation in the middle of the box body is reduced.

Description

technical field [0001] The invention relates to the field of mechanical thermal design, in particular to a thermal control structure and device for spaceborne on-orbit information processing and service loads. Background technique [0002] The application goal of space-borne on-orbit information processing and service load is to provide a basic operating environment for low-orbit load data on-orbit processing and resource service applications, and to receive and cache the original data of remote sensing loads and position and attitude information in real time to achieve fast data processing. Receive service requests from users and provide corresponding information services. Its data source is a variety of load information obtained in real time, including but not limited to visible light, infrared, SAR, etc. The functions mainly include the following four aspects: 1. Support fast processing of load data; 2. Real-time monitoring and management of resources; 3. High-speed data...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 杨雷王珂乔志宏窦翔宇张璐朱清淋盛强
Owner TECH & ENG CENT FOR SPACE UTILIZATION CHINESE ACAD OF SCI
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