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Data center

A data center and heat exchange body technology, which is applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve problems affecting equipment performance, low cooling efficiency, and large fan energy consumption, etc., to achieve shortening The effect of sending cold path, improving efficiency and reducing energy consumption

Inactive Publication Date: 2016-11-23
BEIJING BAIDU NETCOM SCI & TECH CO LTD
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Problems solved by technology

[0002] With the development of network and communication technology, a large number of data processing equipment, networking equipment and telecommunication equipment are concentrated in the data center computer room. The heat generated by these electronic equipment during work will affect the performance, stability and service life of equipment components. Adverse effects, especially if the equipment installed in the cabinet is more prone to heat accumulation, which affects the performance of the equipment
However, in the existing data centers, the cabinets are set up in a back-to-back or face-to-face mode, and precision air conditioners or inter-row air conditioners are usually used for cooling. Huge, with inefficient cooling, requires a data center that reliably increases energy efficiency and reduces energy costs

Method used

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Embodiment Construction

[0023] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for the convenience of description, only the parts related to the related invention are shown in the drawings.

[0024] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0025] figure 1 A perspective view of a data center implemented by two rows of cabinet assemblies in an embodiment of a data center to which the present application may be applied is shown.

[0026] Such as figure 1 As shown, the data center may include multiple cabinet as...

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Abstract

The application discloses a data center. The data center comprises a plurality of cabinet assemblies arranged in the same direction. The cabinet assemblies include cabinet columns, heat exchange bodies, and sealing parts. The cabinet columns and the heat exchange bodies are alternatively arranged in parallel. The sealing parts are arranged between the cabinet columns and the heat exchange bodies for sealing spaces between air outlets at back sides of the cabinet columns and the heat exchange bodies. The embodiment improves the heat exchange efficiency of the cabinet assemblies of the data center, shortens a cold-feeding path, and greatly reduces the data center energy consumption.

Description

technical field [0001] The present application relates to the technical field of cooling, in particular to the technical field of cooling of data centers, and in particular to data centers for storing data processing equipment, networking equipment and telecommunication equipment. Background technique [0002] With the development of network and communication technology, a large number of data processing equipment, networking equipment and telecommunication equipment are concentrated in the data center computer room. The heat generated by these electronic equipment during work will affect the performance, stability and service life of equipment components. Adverse effects, especially equipment installed in the cabinet are more prone to heat accumulation, which affects the performance of the equipment. However, in the existing data centers, the cabinets are set up in a back-to-back or face-to-face mode, and precision air conditioners or inter-row air conditioners are usually ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20718H05K7/20763
Inventor 郝玉涛张素丽于昌庆
Owner BEIJING BAIDU NETCOM SCI & TECH CO LTD
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