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Mesoscale forming ultimate tensile sample, preparation method and mechanical measurement method

A technology for tensile specimens and forming limits, which is applied in the field of strain measurement, can solve the problems of low strength of specimens, reduced accuracy of forming limit diagrams, inability to effectively guide the optimization of forming processes, etc., to achieve clear outlines and overcome printing grid lines gross effect

Active Publication Date: 2022-03-11
HARBIN INST OF TECH AT WEIHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method is only applicable when there is a continuous optical path between the surface of the tested sample and the measuring lens. Continuous, the measurement method can not achieve the goal of strain measurement
Moreover, due to the small thickness of the mesoscale sample and the low strength of the sample, the speckle layer sprayed on the surface of the sample by spray paint will obviously affect the mechanical properties of the sample
[0007] It can be seen that the above two methods cannot accurately measure the strain data of the sample in the forming limit experiment due to their respective limitations, resulting in a decrease in the accuracy of the forming limit diagram, which cannot effectively guide the optimization of the forming process

Method used

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  • Mesoscale forming ultimate tensile sample, preparation method and mechanical measurement method
  • Mesoscale forming ultimate tensile sample, preparation method and mechanical measurement method
  • Mesoscale forming ultimate tensile sample, preparation method and mechanical measurement method

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Embodiment 1

[0056] Depend on figure 1 , image 3 As shown, the present invention provides a mesoscale forming limit tensile sample, the tensile sample 4 is a dumbbell-shaped sample, which is provided with a clamping portion 42 and an intermediate testing portion 41, and on the surface of the intermediate testing portion 41 Magnetron sputtering metal coating 8, metal coating 8 is used as the strain mark of the mechanical performance test of tensile sample 4; The thickness does not exceed 300nm.

[0057] The metal coating 8 can be a plurality of tiny circles with mesoscopic dimensions, preferably distributed in a rectangular array. The thickness of the metal plating film 8 is preferably 100-200 nm.

[0058] Tensile sample 4 can be selected according to the actual needs of the mechanical performance test of the material, for example figure 2 As shown, the total length L of tensile specimen 4 0 is 48mm, the thickness D of the tensile sample 4 is 0.2mm; the length L of the middle test pa...

Embodiment 2

[0065] The invention provides a method for preparing a mesoscale forming limit tensile sample, which comprises the following steps:

[0066] (1) prepare the tensile sample 4 described in embodiment 1, this tensile sample 4 is a dumbbell-shaped sample, the material is pure copper, and the thickness D of the tensile sample 4 is no more than 0.5mm;

[0067] (2) Preparation such as Figure 5The metal-coated forming plate 2 shown is a plate-shaped structure, which is provided with a plurality of first through holes 21 of mesoscopic microscopic geometric figures, and the first through holes 21 are distributed in an array. A through hole 21 is adapted to the size and distribution of the metal coating 8;

[0068] (3) The metal-coated formed plate 2 is completely tightly covered and attached to the surface of the middle test portion 41 of the tensile sample 4; usually the width of the metal-coated formed plate 2 is required to be greater than the width of the middle test portion 41 of...

Embodiment 3

[0079] In embodiment 2, the surface of the middle test portion 41 of the tensile sample 4 is fully covered and attached to the metal-coated formed plate 2, and the existing technical means such as clips can be used to clamp the two firmly, and the present invention can also be used. Invented magnetron sputtering forming device.

[0080] The magnetron sputtering forming device of the present invention can carry out appropriate structural design according to the requirements such as the shape and size of the tensile sample 4, so as to be suitable for various metals used for the intermediate test portion 41 of the mesoscale forming limit tensile sample 4 The magnetron sputtering forming of coating film 8, for example by Figure 8 , Figure 9 As shown, the magnetron sputtering forming device is used for the magnetron sputtering forming of the metal coating 8 of the intermediate test portion 41 of the dumbbell-shaped sample. Such as Figure 11 , as shown in FIG. 12, the magnetro...

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Abstract

The invention provides a mesoscale forming ultimate tensile sample, a preparation method and a mechanical measurement method, and solves the problem that the existing strain distribution measurement method of the mesoscale forming ultimate tensile sample cannot meet the tensile mechanical measurement of the sample in a low-transparency medium environment. In order to solve the technical problems that a mesoscale forming limit tensile sample is provided with a clamping part and a middle testing part, metal coating films are formed on the surface of the middle testing part through magnetron sputtering, the metal coating films are a plurality of mesoscale tiny geometric figures and are distributed in an array manner, the thickness of the metal coating films is not more than 300nm, and the thickness of the metal coating films is not more than 300nm. The invention further discloses a preparation method and a mechanical measurement method of the mesoscale forming ultimate tensile sample, and the mesoscale forming ultimate tensile sample can be widely applied to the technical field of strain measurement.

Description

technical field [0001] The application relates to the technical field of strain measurement, in particular to a mesoscale forming ultimate tensile sample, a preparation method and a mechanical measurement method. Background technique [0002] On the mesoscopic scale, when the number of grains in the thickness direction of the metal sheet decreases to a critical value, for example, for a pure copper sheet, the value is ~4, the plastic deformation ability of the metal sheet will decrease rapidly, and the size effect will appear. a phenomenon. By means of normal loading, pressure is applied to the thickness direction of the sample. During the deformation process, the sample is not only subjected to the tensile stress in the length direction of the sample, but also the compressive stress perpendicular to the surface of the sample, which is conducive to healing. The micro-cracks of the material during the deformation process can improve its plastic deformation ability and help t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/28G01B11/16
CPCG01N1/28G01B11/16
Inventor 陈刚王瀚张鹏朱强王传杰
Owner HARBIN INST OF TECH AT WEIHAI
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