Protection reinforcing device for satellite-borne equipment circuit

Abstract

The invention discloses a protecting and reinforcing device for a satellite-borne equipment circuit, and belongs to the technical field of satellite-borne equipment circuits, the protecting and reinforcing device comprises a fixing frame, four empty grooves are formed in the fixing frame, damping mechanisms are mounted among the four empty grooves, and a connecting frame is mounted among the four damping mechanisms. The closed space formed between the first heat conduction pipe and the second heat conduction pipe is filled with air, the inner hole and the outer hole of the closed space are kept balanced, the back face of the circuit board is in close contact with the two hollow heat conduction blocks, and the two hollow heat conduction blocks are communicated through a pipeline to be combined into a whole. And the two hollow heat conduction blocks and the two first heat conduction pipes are combined into a whole, so that the device has the advantages that the circuit board can be stably fixed, meanwhile, damping protection is carried out, dual-power efficient heat dissipation can be carried out, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of on-board equipment circuits, and more specifically, to a protection and reinforcement device for on-board equipment circuits. Background technique [0002] The temperature of electronic components on the circuit board has a great influence on the performance and life of electronic components. With the continuous improvement of the functional performance of electronic components, the power consumption of electronic components is also increasing. How to efficiently and reliably dissipate heat for electronic components has become an electronic system Important issues in design, especially in onboard electronic products, due to environmental constraints, it is often impossible to use air cooling for heat dissipation, and the liquid cooling system is too complicated. Therefore, onboard electronic products mainly use conduction cooling and heat dissipation. The heat sink conducts the heat generated by electroni...

AI Technical Summary

Problems solved by technology

[0003] Because the existing equipment adopts a separate cooling and heat dissipation method, the circuit board and the fixed mounting frame can only be fixedly connected. When the spaceborne equipment is running, vibration will occur, which may cause damage to the circuit board. When the heat conduction rate of the component reaches the upper limit, it cannot be prompted, and it is difficult to meet the long-term high-load operation of the circuit board. It can only be opened at intervals, which affects the working efficiency of the device. Therefore, we propose a protection and reinforcement device for the circuit of the on-board equipment. to solve such problems

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