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Insulation shielding composite film capable of storing heat and high in safety and application of insulation shielding composite film

An insulation shielding and safety technology, applied in the field of conductive and heat-conducting composite materials, can solve problems such as interference with the normal operation of electronic modules, environmental disturbances, and reduced work performance

Pending Publication Date: 2022-03-01
东莞市博恩复合材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the short and light space in electronic equipment cannot or is difficult to conduct heat away simply by setting up fans, and the useless electromagnetic waves generated also wander in places with gaps.
When the chip or electronic module is in a high temperature environment, the working performance will be reduced and the working life will be shortened; and the useless electromagnetic waves will interfere with the normal operation of the electronic module, and may cause unnecessary troubles to the environment

Method used

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  • Insulation shielding composite film capable of storing heat and high in safety and application of insulation shielding composite film

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Embodiment Construction

[0024] See figure 1 The heat-conducting and highly high insulating shield composite film of the present invention is composed of a thermally conductive insulating polyimide film, a nanomotogenic graphite sheet, a thermally conductive layer, and an release film. Its upward, in turn, the upper layer thermally conductive insulating polyimide film 10, the upper heat transfer layer 40, the nanomotogenic graphite sheet 20, medium thermally charged layer 50, lower thermally conductive insulating polyimide film 30, the lower heat transfer layer 70 and the release film 60. The composite film is a heat dissipation device of a chip or an electronic module in an electronic device.

[0025] Such as figure 1 As shown, the upper thermally conductive insulating polyimide film 10 has excellent thermally conductive properties and strong insulating properties. The upper layer thermally conductive insulating polyimide film 10 has a thickness of 0.0125 to 0.025 mm, and its peripheral size is greater t...

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Abstract

An insulation shielding composite film capable of storing heat and high in safety comprises an upper heat-conducting insulation polyimide film (10), an upper heat-conducting glue layer (40), a nanometer energy storage graphite flake (20), a middle heat-conducting glue layer (50), a lower heat-conducting insulation polyimide film (30), a lower heat-conducting glue layer (70) and a release film (60) from top to bottom in sequence. The nano energy storage graphite flake (20) is coated between the upper-layer heat-conducting insulating polyimide film (10) and the lower-layer heat-conducting insulating polyimide film (30); and the nano energy storage graphite flake (20) is formed by compounding a conductive graphite flake and a nano phase change material. The composite film has good heat conduction and insulation performance and good shielding and heat storage functions, the temperature of electronic equipment can be effectively reduced, and the service life of the electronic equipment is prolonged.

Description

[0001] The present application is a score application for invention patents 201910078050.4, inventive Names 201910078050.4, inventive named "Insulation Shielding Composite Filled Composite Film", which can be stored and safely high. Technical field [0002] The present invention relates to a conductive thermally conductive composite material, and more particularly to a thermally conductive and insulating properties, with shielding and heat storage, avoiding heat-saving and high insulation shielding composite films for short circuits. Background technique [0003] With the rapid development of the electronics industry, electronic equipment such as personal computer, mobile phone, server, and GPS navigation devices are getting more and more popular. At the same time, the size of electronic equipment is getting smaller and smaller, and more and more functions are increasing. The more powerful. This requires the internal chip or electronic module of the electronic device to be powerfu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/29C09J7/38C09J183/04C09J11/04
CPCC09J7/29C09J7/38C09J183/04C09J11/04C09J2467/006C09J2400/10C08K2003/385C09J2479/086C08K3/38
Inventor 陆冬华
Owner 东莞市博恩复合材料有限公司
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