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Composite substrate applied to direct type backlight LED chip and preparation method of composite substrate

A LED chip and composite technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low light extraction efficiency of sapphire substrates, and achieve the effects of improving axial light output efficiency, improving light output efficiency, and improving reflection efficiency

Pending Publication Date: 2022-02-18
黄山博蓝特光电技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a composite substrate applied to direct-lit backlight LED chips and a preparation method thereof, so as to solve the problem of low light extraction efficiency of existing patterned sapphire substrates

Method used

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  • Composite substrate applied to direct type backlight LED chip and preparation method of composite substrate
  • Composite substrate applied to direct type backlight LED chip and preparation method of composite substrate
  • Composite substrate applied to direct type backlight LED chip and preparation method of composite substrate

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Embodiment

[0041] Embodiment, a kind of compound type substrate that is applied to direct type backlight LED chip, such as Figure 15As shown, a sapphire substrate 100 is included, and the first nanometer pattern 101 and the second nanometer pattern 102 arranged periodically are arranged on the sapphire substrate 100, and the first nanometer pattern 101 and the second nanometer pattern 102 include The hexagonal pyramid reflection layer 201 disposed on the sapphire substrate 100 and the dielectric insulating layer 401 covering the outside of the hexagonal pyramid reflection layer 201 . A DBR reflective layer 600 is also disposed on the top of the dielectric insulating layer 401 . The bottom width of the first nano-micro pattern 101 is 0.5-5 μm, the bottom width of the second nano-micro-pattern 102 is 0.5-5 μm; the height of the first nano-micro pattern 101 and the second nano-micro pattern 102 and The ratio of the bottom width is 0.62-0.68. Thus, two kinds of nanometer patterns with dif...

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Abstract

The invention discloses a composite substrate applied to a direct type backlight LED chip and a preparation method of the composite substrate. The composite substrate applied to the direct type backlight LED chip comprises a sapphire substrate, nano-micron patterns are arranged on the sapphire substrate, and the nano-micron patterns are arranged on the sapphire substrate. Each nano-micron pattern comprises a hexagonal pyramid reflecting layer and a dielectric insulating layer which are arranged on the sapphire substrate. According to the composite substrate, the light emitting efficiency of light can be remarkably improved, and the brightness of an LED is improved. The preparation method of the composite substrate applied to the direct type backlight LED chip comprises the steps of cleaning, reflective layer coating, gluing, primary dry etching, cleaning, dielectric insulation layer deposition, primary gluing, exposure, development, secondary dry etching, secondary gluing, exposure, development, DBR reflective layer deposition and the like. The composite substrate prepared through the method has the advantages of being high in machining precision, good in product stability and high in light emitting efficiency, and can be widely applied to the field of LED substrate manufacturing.

Description

technical field [0001] The invention relates to the field of LED substrate manufacturing, in particular to a composite substrate applied to direct-lit backlight LED chips and a preparation method thereof. Background technique [0002] As a new solid-state lighting source, LED has the characteristics of small size, long life, good reliability, energy saving and environmental protection, and has been widely used in the field of lighting and display. At present, the display industry mostly adopts side-input and direct-input light sources. Compared with side-input, direct-input light sources have lower cost, higher light efficiency utilization, and wider application occasions. [0003] The current direct-type LED patterned substrates, the means to improve the light extraction efficiency of LED devices, mostly use the pattern interface to change the incident angle of light and suppress the internal total reflection of the LED; at the same time, the patterns of traditional pattern...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/22H01L33/10H01L33/00H01L33/44H01L33/46
CPCH01L33/22H01L33/10H01L33/46H01L33/44H01L33/00
Inventor 冯晋荃彭艳亮徐良李昌勋韩理想刘建哲祝小林
Owner 黄山博蓝特光电技术有限公司
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