Moving and transporting protection device for semiconductor device
A protection device, semiconductor technology, applied in the directions of transportation and packaging, containers, packaging, etc., can solve the problems of inconvenient placement and taking, falling off, pin bending, etc., to ensure the ventilation and filtration effect, easy to replace, easy to use The effect of device preservation
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Embodiment 1
[0043] see figure 1 and figure 2 , a mobile transport protection device for semiconductor devices, including a protection box 1, the protection box 1 is movably connected to a dodge door 19, including;
[0044] The turntable 2 is arranged in the protection box 1, and the back of the turntable 2 is connected to the side wall of the protection box 1 through a push mechanism;
[0045] A set of clamping plates 8, a set of clamping plates 8 are symmetrically arranged on the turntable 2, a set of clamping plates 8 are respectively slidably connected with the turntable 2, and the clamping plates 8 are opposite to each other. The sides are respectively equipped with clamping protection components;
[0046] When specifically using the mobile transport protection device, open the dodge door 19 that is movably connected to the protection box 1, and then push the turntable 2 provided with the clamping plate 8 from the inside of the protection box 1 to the outside of the protection box ...
Embodiment 2
[0055] Further, in this embodiment, the clamping protection assembly includes two compressed airbags 10, which are respectively arranged on opposite sides of the two clamping plates 8, and the two compressed airbags 10 are respectively arranged on the protective box 1 The air suction pump 3 at the top communicates through the air supply pipe 13. When the semiconductor device needs to be clamped, the semiconductor device is placed between a set of clamping plates, then the air suction pump 3 is turned on, and the air is passed through the air supply pipe 13 Inflate the compressed airbags 10 until the compressed airbags 10 on both sides clamp the semiconductor device.
[0056] In order to facilitate the clamping of the semiconductor device by the compressed airbag, two interfering soft boards are included, which are respectively arranged on the opposite sides of the two compressed airbags 10, so as to prevent the contact surface of the compressed airbag 10 from being soft and aff...
Embodiment 3
[0067] Further, in order to ensure that the rotating disk 2 can be sent by the rotating push mechanism to open the dodge door 19 is pushed out of the protection box 1, so the dodge door 19 is opposite to the front of the turntable 2, and in order to ensure that the protection box 1 is in the closed state, the clamping plate 8 There is no gap between the dodge door 11, so the inside of the dodge door 11 is provided with a buffer air bag 18, and the buffer air bag 18 is in conflict with the end of the clamping plate 8 near the dodge door 19.
[0068] Further, in this embodiment, in order to ensure the ventilation of the wedding in the protective box 1, the protective box 1 also includes a fresh air system, because the semiconductor device storage environment requires certain requirements on temperature and humidity, so as to avoid damage to the semiconductor device, Therefore, a temperature and humidity sensor should be included for monitoring the temperature and humidity in the ...
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