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Novel power amplifier

A technology of power amplifiers and amplifiers, applied in the field of communications, can solve the problems of power modules that cannot be tested separately, unfriendly high-power heat dissipation, and difficulties in testing and maintenance, and achieve the effects of low insertion loss, enhanced structural strength, and increased single-module gain

Pending Publication Date: 2022-01-28
成都浩翼创想科技有限公司
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Problems solved by technology

Although the working bandwidth of this structure can realize ultra-broadband work, due to the characteristics of its cylindrical structure, it is not friendly to high-power heat dissipation; each module cannot meet the boundary conditions of the electromagnetic field, and must be combined to form a testable unit. The power module cannot be tested separately, and it is extremely difficult to test and repair; the chips installed in each independent module are limited, and the secondary power integration

Method used

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Embodiment

[0043] Such as Figure 1~2 As shown, the new power amplifier includes a packaging box and an outer cover plate arranged on the top of the packaging box. The packaging box is used to accommodate electronic components.

[0044] A power management module, a drive amplification module, a power distribution network module, and a power synthesis network module are arranged in the packaging box in sequence from top to bottom. The power management module supplies power to the power-consuming components of the amplifier.

[0045] Among them, the RF input connector is connected to the drive amplifier module; the drive amplifier module sends the signal processed by the amplifier to the power distribution distribution network module, and distributes it as multiple signals, and the multiple signals are respectively sent to the power synthesis network module to receive and amplify After processing, the output is synthesized, and the RF output connector is connected with the power synthesi...

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Abstract

A novel power amplifier comprises a packaging box and an outer cover plate arranged at the top of the packaging box; a driving amplification module, a power distribution network module and a power synthesis network module are sequentially arranged in the packaging box from top to bottom; a radio frequency input connector is connected with the driving amplification module; the driving amplification module sends a signal processed by the amplifier to the power distribution network module, the signal is distributed into multiple paths of signals, the multiple paths of signals in the power distribution network module are received by the power synthesis network module in multiple paths and are synthesized and output after being amplified, and the radio frequency output connector is connected with the power synthesis network module; and the multipath signals are respectively output from the radial direction of the power synthesis network module, and the multipath signals are respectively received from the radial direction of the power distribution network module.

Description

technical field [0001] The invention relates to the technical field of communication, in particular to a 6-18GHz 200W power amplifier. Background technique [0002] In recent years, with the rapid development of civil and military communication technology systems, more and more attention has been paid to solid-state power amplifiers with reliable performance, ultra-wideband, and high power. Traditional power amplifiers are mainly realized by vacuum tubes and traveling wave tubes. However, traditional true tube amplifiers are heavy in weight, huge in size, require extremely high operating voltage, short in life, and poor in reliability. Based on MMIC, high power output is obtained through power synthesis technology. It has the characteristics of small size, high reliability, long life, and convenient use. It has the incomparable advantages of traditional vacuum tubes. Major scientific research institutes and high-tech enterprises at home and abroad have also invested more an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/12H05K7/20
CPCH01P5/12H05K7/20
Inventor 赖邱亮
Owner 成都浩翼创想科技有限公司
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