Method, device and equipment for calculating wafer period in wafer

Abstract

The invention discloses a method, a device and equipment for calculating a wafer period in a wafer. The method comprises the following steps of: acquiring a grayscale image at least comprising three wafers arranged along a vertical direction and / or a horizontal direction in the wafer; performing filtering processing on the grayscale image to obtain a high-frequency image; calculating the gray projection of the high-frequency image in the vertical direction and / or the horizontal direction to obtain a gray distribution curve; and acquiring the period of the wafer in the vertical direction and / or the horizontal direction according to the gray distribution curve, wherein the wafer is rectangular, the vertical direction is parallel to one side of the wafer, and the horizontal direction is parallel to the other side of the wafer. Therefore, the wafer period in the wafer is automatically calculated, manual intervention is reduced, the calculation speed and stability are improved, and the adaptability to different types of wafers is improved.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of semiconductors, and in particular to a method, device and equipment for calculating a wafer period in a wafer. Background technique [0002] With the continuous development of the semiconductor industry, the types of wafers and chips are becoming more and more abundant. To ensure the quality of semiconductor wafers and chip products, the importance of wafer inspection technology is increasing. Compared with manual wafer inspection, machine vision inspection technology has higher inspection accuracy and faster inspection efficiency. In the method of machine vision inspection of wafers, due to the need to set the path of machine vision inspection, etc., it is necessary to correctly calculate the wafer cycle to ensure the accuracy of the inspection path, thereby ensuring the accuracy and correctness of the inspection. In the previous methods, most It is necessary to manually select...

AI Technical Summary

Problems solved by technology

In the method of machine vision inspection of wafers, due to the need to set the path of machine vision inspection, etc., it is necessary to correctly calculate the wafer cycle to ensure the accuracy of the inspection path, thereby ensuring the accuracy and correctness of the inspection. In the previous methods, most It is necessary to manually select the period unit to match the calculation cycle of the wafer, the calculation speed is slow and time-consuming

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