Laser melting deposition connection method for dissimilar high-temperature alloy in aero-engine

A laser melting deposition, aero-engine technology, applied in the direction of improving energy efficiency, process efficiency, etc., can solve problems such as difficulty in realization and cracking, and achieve the effects of low porosity, high utilization rate, significant social and economic benefits

Active Publication Date: 2022-01-11
辽宁增材制造产业技术研究院有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the biggest problem facing the preparation of the overall blisk structure by laser melting deposition is that cracking occurs in the process of depositing the material for the blade, which makes it difficult to realize the molding method by depositing all superalloy powders

Method used

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  • Laser melting deposition connection method for dissimilar high-temperature alloy in aero-engine

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The material GH4169 substrate for the wheel disc and the K417G substrate material for the blade are respectively prepared by wire cutting into trapezoids with the same size and flat surfaces. Relatively placed, fixed on the Q235 substrate by double-sided adhesive.

[0025] The GH4169 / K417G gradient material powder mixed according to the ratio of GH4169 and K417G is about 2:1 and 1:2, respectively pre-placed on the side of the GH4169 substrate and the side of the K417G substrate on the Q235 substrate, the width is greater than the two substrates and covers from the GH4169 substrate to the The entire path of the K417G substrate has a thickness of 0.3mm.

[0026] Select FL-Dlight02-3000 W type semiconductor laser, the specific process parameters are as follows: laser power P = 1600-2000W, scanning speed V = 4-6mm / s, scanning direction perpendicular to the connection between the two substrates, the path is reciprocating, The overlap rate is 40-50%. The laser scans from th...

Embodiment 2

[0028] The material GH4169 substrate for the disc and the K417G substrate for the blade are respectively prepared by wire cutting into trapezoids with the same size and flat surfaces.

[0029] Place the hypotenuses of the two substrates opposite to each other, and fix them on the Q235 substrate with double-sided adhesive. The GH4169 / K417G gradient material powder mixed at a ratio of 1:1 is pre-placed on the Q235 substrate, completely covering the path from the GH4169 substrate to the K417G substrate, and the width is larger than the two substrates, and the thickness is 0.3mm.

[0030] Select the FL-Dlight02-3000 W semiconductor laser to melt and deposit the preset gradient material powder. The specific process parameters are as follows: laser power P=1600-2000W, scanning speed V=4-6mm / s, and the scanning direction is perpendicular to the space between the two substrates. The connection path is reciprocating, the overlapping rate is 40-50%, the laser scans from the side of GH41...

Embodiment 3

[0032] The material GH4169 substrate for the disc and the K417G substrate for the blade are respectively prepared by wire cutting into trapezoids with the same size and flat surfaces.

[0033]Place the hypotenuses of the two substrates opposite to each other, and fix them on the Q235 substrate with double-sided adhesive. The GH4169 powder is pre-placed on the Q235 substrate on the side of the GH4169 substrate and the side of the K417G substrate. The width is larger than the two substrates and covers the entire path from the GH4169 substrate to the K417G substrate. The thickness is 0.3mm. Select FL-Dlight02-3000 W type semiconductor laser, the specific process parameters are as follows: laser power P = 1600-2000W, scanning speed V = 4-6mm / s, scanning direction perpendicular to the connection between the two substrates, the path is reciprocating, The overlap rate is 40-50%. The laser scans from the side of the GH4169 substrate, stops when it reaches about half the distance betw...

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Abstract

The invention discloses a laser melting deposition connection method for a dissimilar high-temperature alloy in an aero-engine, belongs to the field of laser melting deposition rapid prototyping. According to the laser melting deposition connection method for the dissimilar high-temperature alloy in the aero-engine provided by the invention, a material matrix for a wheel disc and a material matrix for a blade of the aero-engine are connected through laser melting deposition gradient material powder. Through shape design of the matrix and optimization of technological parameters and the forming process, the matrix and a gradient material deposition layer form good metallurgical bonding, meanwhile, residual stress is greatly reduced, the cracking tendency is reduced, and a compact and uniform connection transition area with the structure and the performance in gradient change is obtained.

Description

technical field [0001] The invention belongs to the field of laser melting deposition rapid prototyping, in particular to a laser melting deposition connection method of dissimilar superalloys in an aero-engine. Background technique [0002] Aeroengines are the "heart" of an aircraft. Because of their high technical content and high manufacturing difficulty, their advanced nature is an important indicator of a country's industrial level. In the development of the new generation of military and civil aircraft manufacturing industry, it can be seen that while improving the reliability of the engine, reducing the structural weight of engine parts is an important way to reduce fuel consumption and increase the thrust-to-weight ratio. For this reason, the development and research and development of advanced lightweight high-performance materials and lightweight structures are the main trends at present. [0003] The turbine disk and blades are the core components of the turbine ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F7/08B22F5/00B22F3/105
CPCB22F7/064B22F5/00Y02P10/25
Inventor 刘帅
Owner 辽宁增材制造产业技术研究院有限公司
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