Bump connection placement in quantum devices in a flip chip configuration
A flip-chip and bump technology applied in the field of component placement, which can solve the problems of additional complexity and increased execution time of quantum algorithms
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[0029] An internal qubit is a qubit that is not located on the periphery of the qubit configuration in the quantum device; in other words, the qubit is located at a physical location other than the periphery of the qubit configuration in the quantum device. The illustrative embodiments recognize that one solution for accessing internal qubits is to configure the quantum device in a flip-chip configuration. A flip-chip configuration, or simply flip-chip, uses bumps already deposited on one or both surfaces to interconnect one surface of a device or chip with the other surface of a second chip so that the two surfaces are parallel to each other, And the bumps on one surface connect to corresponding bumps or surface locations on the second surface. A bump is a conductive structure formed three-dimensionally on a two-dimensional surface using at least a conductive material and in some cases a superconductive material. One attribute of bumps as contemplated herein is that the bump...
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