Laminating equipment

A lamination equipment and lamination technology, applied in lamination devices, control lamination, lamination, etc., can solve the problems of unguaranteed quality, high manual labor intensity, low efficiency, etc., to achieve layout reduction and labor cost reduction , the effect of reducing the number of personnel

Pending Publication Date: 2022-01-07
HUIZHOU DESAY AUTOMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, most of the current equipment is semi-automated. In the actual production process, more people still need to participate in the production. This is not only labor-intensive, low-efficiency, and high-cost, but also the quality cannot be guaranteed.

Method used

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Embodiment Construction

[0037] A number of embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, for the sake of simplifying the drawings, some well-known and commonly used structures and components will be shown in a simple schematic manner in the drawings.

[0038] In addition, in the present invention, descriptions such as "first", "second" and so on are used for description purposes only, and do not refer to the meaning of order or sequence, nor are they used to limit the present invention, but are only for the purpose of distinguishing the following The components or operations described by the same technical terms are merely used, but should not be understood...

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Abstract

The invention discloses laminating equipment which comprises a first processing line, a second processing line, a first storage device, a second storage device and a plurality of lamination pressure maintaining devices, the first processing line and the second processing line are oppositely arranged, the first storage device is located at the end of the first processing line, and the second storage device is located at the side of the second processing line. The lamination pressure maintaining devices are located between the first processing line and the second processing line. The first processing line and the second processing line are oppositely arranged, so that independent work of the first processing line and the second processing line is facilitated; due to the arrangement of the positions of the first storage device and the lamination pressure maintaining device, semi-finished products can be conveniently fed; in addition, the position of the second storage device is arranged, so that discharging of machined finished products is facilitated; full automation of production is achieved, the number of workers is reduced, the labor cost is reduced, the production efficiency is improved, and the product quality is guaranteed; and meanwhile, the overall occupied area is reduced through reasonable layout, and the production and manufacturing cost of enterprises is further reduced.

Description

technical field [0001] The present invention relates to the technical field of mechanical equipment, in particular to a bonding equipment. Background technique [0002] With the improvement of scientific and technological strength, more and more products are beginning to be produced by equipment instead of manpower. Different equipment achieves different requirements and meets different processing needs. Compared with traditional manual production, its production efficiency has been improved. promote. [0003] However, most of the current equipment is semi-automated. In the actual production process, more people still need to participate in the production. In this way, not only the labor intensity is high, the efficiency is low, and the cost is high, but the quality cannot be guaranteed. Contents of the invention [0004] Aiming at the deficiencies of the prior art, the present invention provides a bonding device. [0005] A bonding equipment disclosed in the present inv...

Claims

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Application Information

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IPC IPC(8): B32B37/10B32B41/00
CPCB32B37/10B32B41/00
Inventor 兰学义王松李肖芳赵春明徐巍
Owner HUIZHOU DESAY AUTOMATION TECH
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