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Chemical mechanical fine polishing liquid for silicon wafer

A chemical-mechanical, fine-polishing technology, applied in the direction of polishing compositions containing abrasives, to reduce scratches, increase polishing rate, and increase friction area

Active Publication Date: 2022-01-04
深圳市科玺化工有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As far as domestic CMP polishing materials are concerned, only the middle and low-end market of domestic semiconductor CMP polishing can be used.

Method used

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  • Chemical mechanical fine polishing liquid for silicon wafer
  • Chemical mechanical fine polishing liquid for silicon wafer
  • Chemical mechanical fine polishing liquid for silicon wafer

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Embodiment Construction

[0023] For better illustrating the present invention, facilitate understanding technical scheme of the present invention, typical but non-limiting embodiment of the present invention is as follows:

[0024] Table 1 is the formula of the implementation cases 1 to 3 of the chemical mechanical fine polishing liquid of the present invention. According to the components listed in Table 1 and their mass percentages, they are uniformly mixed in a fluorine-coated reactor, and then the fine polishing is adjusted with a pH regulator. Liquid to the corresponding pH value, that is, silicon wafer chemical mechanical fine polishing liquid.

[0025] Wherein, the preparation method of polyellipsoidal silicon dioxide abrasive particle is, add analytical pure catalyst tartaric acid and ultrapure deionized water to the mixed alcohol solvent of analytical pure ethanol and isopropanol, stir, be mixed with solution A; Add analytically pure organic silicon source to solution A on time and in quantit...

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Abstract

The invention provides chemical mechanical fine polishing liquid for a silicon wafer. The fine polishing liquid is specifically prepared by the following steps: mixing 2-30wt% of high-purity ellipsoidal silicon dioxide large particles A, 2-15wt% of high-purity silicon dioxide spherical small particles B, 0.01-1wt% of a pH regulator, 0.01-2wt% of a chelating agent, 0.001-0.1 wt% of a surfactant, 0.01-1wt% of a dispersing agent, 0.1-2wt% of an oxidizing agent and the balance of ultrapure deionized water of more than 18 megohms in a fluorine coating reaction kettle, and performing uniform stirring to obtain the fine polishing liquid. According to the polishing liquid disclosed by the invention, in an alkaline environment with the pH value of 8-11, the silicon dioxide grinding particles with different forms and particle sizes are matched and used, the friction area is increased and the polishing rate of a silicon wafer is increased in the grinding process by the large poly-ellipsoidal particles, and the scratch of the silicon wafer is reduced by the lubricating effect of the small spherical particles in the grinding process.

Description

technical field [0001] The invention relates to a chemical mechanical fine polishing liquid for silicon wafers and a preparation method thereof. Background technique [0002] Chemical Mechanical Polishing (CMP) is the key process to achieve global uniform planarization of silicon wafers in the integrated circuit manufacturing process. Selecting suitable materials for polishing to achieve high-quality surface polishing is currently the only one that can take into account both global and local flatness of the surface. technology. Chemical mechanical polishing fluid is an essential consumable in the CMP process. CMP uses the relative motion between the wafer and the polishing head to achieve planarization. The polishing head is pressed against the rotating polishing pad with a certain pressure. The chemical mechanical polishing fluid flows between the silicon wafer surface and the polishing pad, and then the polishing fluid is polished. Under the action of pad transmission an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 张倩郭建学杨兴旺刘三川
Owner 深圳市科玺化工有限公司
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