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Ultra-light heat-insulation pouring sealant and preparation method and application thereof

A potting glue, ultra-light technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of difficult potting operations, increased operating load, and increased vehicle weight to achieve improved isolation Thermal performance, easy construction and use, and the effect of reducing density

Active Publication Date: 2021-12-24
GUANGZHOU JOINTAS CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing addition-type heat-conducting potting compound has a high density, which will increase the overall weight of the car, thereby increasing the operating load, and the potting compound has high viscosity and poor fluidity, making the potting operation difficult

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] An ultra-light heat-insulating potting compound, which is composed of component A and component B, and the mass ratio of component A to component B is 1:1. Wherein, component A is composed of the following components in parts by weight: 50 parts of vinyl-terminated polydimethylsiloxane, 25 parts of methylpolyhydrogensiloxane and 200 parts of glass microspheres. Component B is composed of the following components in parts by weight: 50 parts of vinyl-terminated polydimethylsiloxane, 100 parts of glass microspheres and 1 part of platinum catalyst.

[0030] In this embodiment, the glass beads of component A and B are composed of the first glass beads, the second glass beads and the third glass beads respectively, and the first glass beads, the second glass beads and the The mass ratio of the third glass beads is 6:3:1; the particle diameter D50 of the first glass beads is 80 μm, and the specific gravity is 0.15 g / cm 3; The particle diameter D50=50 μm of the second glass m...

Embodiment 2

[0036] An ultra-light heat-insulating potting compound, which is composed of component A and component B, and the mass ratio of component A to component B is 1:1. Wherein, component A is composed of the following components in parts by weight: 100 parts of vinyl-terminated polydimethylsiloxane, 50 parts of methyl polyhydrogensiloxane and 300 parts of glass microspheres. Component B is composed of the following components in parts by weight: 10 parts of vinyl-terminated polydimethylsiloxane, 10 parts of glass microspheres and 0.5 parts of catalyst. The glass microspheres of A component and B component are the same as in Example 1. The preparation method of the ultra-light heat-insulating potting glue is the same as that in Example 1.

Embodiment 3

[0038] An ultra-light heat-insulating potting compound, which is composed of component A and component B, and the mass ratio of component A to component B is 1:1. Wherein, component A is composed of the following components by weight: 10 parts of vinyl-terminated polydimethylsiloxane, 10 parts of methyl polyhydrogensiloxane and 10 parts of glass microspheres. Component B is composed of the following components in parts by weight: 100 parts of vinyl-terminated polydimethylsiloxane, 200 parts of glass microspheres and 1 part of catalyst. The glass microspheres of A component and B component are the same as in Example 1. The preparation method of the ultra-light heat-insulating potting glue is the same as that in Example 1.

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PUM

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Abstract

The invention discloses an ultra-light heat-insulation pouring sealant and a preparation method and application thereof. The pouring sealant comprises a component A and a component B, and the mass ratio of the component A to the component B is 1: 1; the component A is prepared from the following components in parts by weight: 10 to 100 parts of vinyl terminated polydimethylsiloxane, 5 to 50 parts of methyl polyhydrosiloxane and 10 to 500 parts of glass beads; the component B is prepared from the following components in parts by weight: 10 to 100 parts of vinyl-terminated polydimethylsiloxane, 0 to 500 parts of glass beads and 0.01 to 2 parts of a catalyst; the glass beads in the component A and the component B are composed of at least three glass beads with different specific gravities and particle sizes of 2-150 [mu]m. The glass beads with different particle sizes and specific gravities are combined for use, so that the density of the pouring sealant is reduced, and the heat insulation performance of the pouring sealant is improved.

Description

technical field [0001] The invention belongs to the technical field of heat insulation and protection of lithium batteries, and in particular relates to an ultra-light heat insulation potting glue and its preparation method and application. Background technique [0002] With the increasing shortage of oil resources, the development of new energy vehicles has become more and more rapid in recent years, but its technology is not mature enough, and there are still problems such as lithium battery heating. In order to solve the heating problem of lithium batteries, most of them currently use additive heat-conducting potting glue to cover lithium batteries. However, the existing addition-type heat-conducting potting compound has a high density, which will increase the overall weight of the car, thereby increasing the operating load, and the potting compound has high viscosity and poor fluidity, making the potting operation difficult. [0003] Therefore, the preparation of pottin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04
CPCC09J183/04C09J11/04C08K2201/005C08K2201/014C08L2203/20C08L83/04C08K7/20Y02E60/10
Inventor 刘廷铸胡国新赵志垒陈柏富黄永军
Owner GUANGZHOU JOINTAS CHEM
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