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RRAM array water-cooling heat dissipation device based on packaging part deionized water

A deionized water, water-cooled heat dissipation technology, applied in the direction of reducing the physical parameters of the carrier and reducing the influence of temperature on the carrier, etc., can solve the problem of difficult to meet the heat dissipation efficiency of the RRAM array, and achieve good thermal conductivity, large contact area, and enhanced affinity. water-based effect

Pending Publication Date: 2021-12-17
XIAN UNIV OF TECH
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a RRAM array water-cooled heat dissipation device based on packaged deionized water, which solves the problem that the existing air-cooled heat dissipation device is difficult to meet the heat dissipation efficiency of the RRAM array

Method used

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  • RRAM array water-cooling heat dissipation device based on packaging part deionized water
  • RRAM array water-cooling heat dissipation device based on packaging part deionized water
  • RRAM array water-cooling heat dissipation device based on packaging part deionized water

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Embodiment Construction

[0017] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0018] The present invention is a kind of RRAM array water-cooling heat dissipation device based on package deionized water, such as Figure 1-2 As shown, the packaging box 4 is included, the inside of the packaging box 4 is fixedly connected with the slot 2, the slot 2 is inserted with the RRAM array module 1, and the top of the packaging box 4 is respectively provided with a first water port 12 and a second water port 13. A cooling mechanism is fixedly connected between the first water port 12 and the second water port 13;

[0019] The heat dissipation mechanism includes a water cooler 8. The water cooler 8 is used to quickly discharge the heat in the circulating water to the surrounding environment, and then flows the cooled circulating water into the packaging box 4. One side of the water cooler 8 is fixed by the first water guide pipe 7....

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Abstract

The invention discloses an RRAM array water-cooling heat dissipation device based on packaging part deionized water, which comprises a packaging box, a slot is fixedly connected in the packaging box, an RRAM array module is inserted in the slot, the top of the packaging box is respectively provided with a first water passing port and a second water passing port, and a heat dissipation mechanism is fixedly connected between the first water passing port and the second water passing port. According to the invention, heat generated by the RRAM array module is rapidly brought to the water cooler outside the packaging box for heat dissipation by using circulating water, and the device adopts deionized water, so that the heat transfer contact area between the device and the RRAM array module is larger, and the invention does not have electrical conductivity, does not cause a short circuit fault, and has a better heat conduction effect.

Description

technical field [0001] The invention belongs to the technical field of water cooling and heat dissipation equipment, and relates to an RRAM array water cooling and heat dissipation device based on packaged deionized water. Background technique [0002] Resistive random access memory (RRAM) is a non-volatile memory (NVM) device that records and stores data information based on resistance changes. It is widely used in the development of neural-inspired deep learning modules and the construction of high-performance storage clusters. Due to the high-density and highly integrated array design scheme of RRAM memory, its advantage is that it greatly reduces the space occupation, but its disadvantage is that it greatly increases the power density, generates a lot of heat during operation, and the array is stacked so that it is in the middle layer The thermal effect of the RRAM module causes ions to escape, so the heat dissipation module of the RRAM array operation becomes a key fac...

Claims

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Application Information

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IPC IPC(8): G11B33/14
CPCG11B33/1413
Inventor 张嘉伟刘林声刘朝晖宋宸秦司晨
Owner XIAN UNIV OF TECH
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