An etching device for a semiconductor structure
An etching device and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the particle contamination of semiconductor wafers, the production qualification rate and performance of residual particles in semiconductor wafers cannot be significantly improved, and semiconductor wafers cannot be significantly improved. The circle cannot be completely etched, etc., to achieve the effect of improving the appearance and neatness
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[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0034] see Figure 1-7 , the present invention provides a technical solution: an etching device for a semiconductor structure, including a main body 1, the outer surface of the main body 1 is provided with a limiting frame 2, and the outer surface of the main body 1 is fixedly connected to the inner surface of the limiting frame 2, The left end of the limit frame 2 is provided with an etching device 3, and the removal effect of the semiconductor wafer is impro...
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