Mixed light generation system for chip testing

A technology for generating systems and chip testing, applied in electronic circuit testing, single semiconductor device testing, optics, etc., can solve the problems of large light source size, inability to meet the requirements of chip testing speed, low testing efficiency, etc., to improve the testing efficiency. Effect

Active Publication Date: 2021-11-26
深钛智能科技(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional wafer test method is realized by broadband light source and spectrum analyzer, but if you want to achieve higher wavelength resolution and test dynamic range, you need to use high-performance adjustable light source for scanning test. At present, the semiconductor chip The testing of the dynamic performance of the modulated light in the wafer test is all serial testing, and the test efficiency is low. In the field of chip testing, various test scenarios require the chip testing machine to provide DC light and modulated light to meet the test requirements of the chip. However, a traditional chip testing machine can only provide one kind of light, and the size of the light source provided is relatively large, which cannot meet the requirements for chip testing speed.

Method used

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  • Mixed light generation system for chip testing
  • Mixed light generation system for chip testing
  • Mixed light generation system for chip testing

Examples

Experimental program
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Effect test

no. 1 example

[0049] Such as figure 1 As shown, the DC optical module 1 includes a DC light source 11 and a DC optical drive control board. The DC optical drive control board has a DC drive circuit. The DC optical drive control board controls the power of the DC light emitted by the DC light source 11 by controlling the current. To realize the control of the output frequency of the DC light, the drive circuit of the DC light drive control board 11 in this embodiment is a light source control circuit commonly used in the field, as long as the control of the DC light can be realized, it will not be repeated here. The DC light source 11 generates a first DC optical path 101, and the first DC optical path 101 generates a second DC optical path 102 through the first collimating lens 12, and the second DC optical path 102 generates a fourth DC optical path 104 through the fly-eye lens assembly, and the fourth DC optical path The optical path 104 generates a fifth direct current optical path 105 t...

no. 2 example

[0053] Such as Figure 5 As shown, the overall hardware structure is the same as that of the first embodiment, except that the irradiation sequence of the optical path changes, that is, the direct current optical path is first irradiated on the grain photosensitive component 4, and the test probe card 3 collects the chip image under direct current light irradiation, Then the modulated light path is irradiated onto the photosensitive component 4 of the grain, and the test probe card 3 collects the chip image under the irradiated light by the modulated light.

no. 3 example

[0055] Such as Image 6 As shown, the overall hardware structure is the same as that of the first embodiment, except that the irradiation sequence of the optical path changes, that is, the modulated optical path is first irradiated onto the grain photosensitive component 4, and the test probe card 3 collects the chip image under the modulated light irradiation, Then the direct current light path is irradiated on the grain photosensitive part 4, and the test probe card 3 collects the chip image under the direct current light irradiation.

[0056] The above-mentioned first embodiment is to irradiate direct current light and modulated light at the same time, the second embodiment is to first direct current light, then modulate light, and the third embodiment is to first modulate light, and then direct current light, according to different embodiments, you can Get chip image information in different states.

[0057] Such as figure 2 As shown, the modulation drive circuit is con...

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Abstract

A mixed light generation system for chip testing comprises a direct current light module and a modulation light module, the modulation light module is arranged on a test probe card, the test probe card clamps a chip to be tested, the test probe card is provided with a plurality of light holes, each light hole is aligned with a crystal grain photosensitive component of the chip to be tested, the direct current light module provides direct current light, the modulation light module provides modulation light, and the direct current light and the modulation light are emitted to the crystal grain photosensitive component of the chip to be detected through the light hole. The direct current light module emits direct-current light, the modulation light module emits modulation light, the modulation light is reflected by the semi-transparent and semi-reflecting mirror, then the modulation light and the direct-current light are respectively or together emitted into the light hole of the test probe card, and the modulation light and the direct-current light are directly emitted to the crystal grain photosensitive part of the chip to be tested through the light hole, so that the subsequent test of the chip is carried out. The effect of simultaneously generating direct-current light and modulated light in the same test system is achieved, and the technical problem that a traditional chip test machine can only provide one light source is solved.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a mixed light generation system for chip testing. Background technique [0002] Optoelectronic semiconductor chips are a type of communication chips that have emerged in recent years. They are widely used in automotive and industrial fields. They are mainly used for photoelectric conversion and have important applications in 5G fronthaul, data centers, and supercomputing interconnection systems. There are two types of optoelectronic semiconductor chip testing, one is wafer testing, and the other is packaging testing. Wafer testing is between wafer manufacturing and packaging in the entire chip manufacturing process. Thousands of bare die (Die) are regularly distributed throughout the entire wafer. Since the dicing package has not been performed, the pins of the chip are all exposed. These extremely tiny pins need to be tested with thinner probes The machine is connected, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R31/26G02B27/09
CPCG01R31/2851G01R31/2601G02B27/0927G02B27/0955G02B27/0938
Inventor 王丽国冯龙柴国占
Owner 深钛智能科技(苏州)有限公司
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