A kind of cutting device for aluminum-based printed circuit board

Abstract

A material cutting device for aluminum-based printed circuit boards, including a conveying component, the discharge end of the conveying component is provided with a transfer component, the transfer component is provided with a positioning component, one end of the transfer component is provided with a material cutting component, and the conveying component faces the positioning component Feeding and conveying the aluminum substrate, so that the aluminum substrate moves to the positioning component, and it is positioned by the positioning component, and the transfer component drives the aluminum substrate positioned by the positioning component to move to the cutting component, so that the cutting component can carry out the aluminum substrate Cutting operation. When the present invention is processing printed circuit boards, especially when processing aluminum-based printed boards, it is convenient to cut the aluminum substrate. A certain amount of aluminum substrates can be stored, and the aluminum substrates can be automatically transferred during cutting, and the aluminum substrates can be accurately positioned to improve the accuracy of cutting and the effect of cutting.

Description

technical field [0001] The invention relates to the related technical field of printed circuit board processing or material cutting equipment, in particular to a cutting device for aluminum-based printed circuit boards. Background technique [0002] The aluminum substrate is a copper-clad printed board with an aluminum plate as the substrate, which is mainly composed of a metal circuit board material, copper foil, a thermally conductive insulating layer and an aluminum substrate. Among them, the circuit layer is equivalent to the copper clad laminate of ordinary PCB, and the thickness of the circuit copper foil is 1oz to 10oz. The insulating layer, which is a layer of low thermal resistance thermally conductive insulating material, has a thickness of 0.003 inches to 0.006 inches. The base layer is usually a metal substrate, usually aluminum or copper, aluminum-based copper-clad laminates or traditional epoxy glass cloth laminates, etc. The metal base layer is the supportin...

AI Technical Summary

Problems solved by technology

[0003] When the aluminum substrate is cut, that is, when the aluminum substrate is cut and rounded, the aluminum substrate is often cut by a cutting device, and then each corner of the aluminum substrate is rounded by a chamfering machine. In this mode of operation, first of all, the entire operation process requires the operator to continuously transfer the aluminum substrate, and then through the cutting and rounding operations, which increases the work intensity of the operator, and at the same time the efficiency is low; secondly, the cutting Especially when chamfering, it is inconvenient to locate the large aluminum substrate, resulting in a large deviation in the tailoring size, and the cost of the aluminum substrate is relatively high, which increases the cost investment of the enterprise. The phenomenon of rounded corners and abnormal shapes appears, which affects the quality of the aluminum substrate

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