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Double-beam coupling water guide machining head device and machining method

A dual-beam coupling and processing head technology, used in metal processing equipment, manufacturing tools, laser welding equipment, etc., can solve the problems of uneven output spot energy, low coupled laser power, and inability to visualize processing, to improve accuracy and The effect of intelligent control level, improving coupled laser power, and improving the uniformity of energy distribution

Pending Publication Date: 2021-11-09
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention provides a double-beam coupling water-conducting processing head device and processing method, which can solve the problems of low coupling laser power, uneven output spot energy, and inability to visualize processing.

Method used

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  • Double-beam coupling water guide machining head device and machining method
  • Double-beam coupling water guide machining head device and machining method
  • Double-beam coupling water guide machining head device and machining method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Embodiment 1 of the present invention provides a dual-beam coupling water-conducting processing head device, including a beam modulation module, a vision module and a control module.

[0049] Such asfigure 1 As shown, the beam modulation module includes a beam combining chamber 11 and a coupling chamber 17. The coupling chamber 17 is screwed under the beam combining chamber 11, and the workpiece is placed under the coupling chamber 17. The laser A3 and the laser B6 are modulated into a combined laser beam 12 whose energy coincides or is symmetrical in space.

[0050] The beam combining chamber 11 includes a housing 1, a first light inlet 2, a second light inlet 5, a mirror group, a beam combining mirror and a moving module; the beam combining mirror includes a first beam combining mirror 16.1 and a second beam combining mirror 16.1 Mirror 16.2; the first light inlet 2 and the second light inlet 5 are connected and arranged on any side wall of the left, right, front and ...

Embodiment 2

[0069] Such as image 3 As shown, Embodiment 2 of the present application provides a dual-beam coupling water-conducting machining head device, which is different from Embodiment 1 in that laser A3 and laser B6 are injected into the beam combining chamber 11 in opposite directions.

[0070] Such as image 3 As shown, the first light inlet 2 and the second light inlet 5 are respectively arranged on the left and right side walls or on the front and back side walls of the beam combining chamber 11; in this embodiment, the first light inlet 2 is arranged on the On the left side wall of the beam combining chamber 11 , the second light inlet 5 is oppositely arranged on the right side wall of the beam combining chamber 11 .

[0071] The reflector group includes a third reflector 19.1, a fourth reflector 19.2 and a fifth reflector 19.3, the third reflector 19.1 is coaxial with the center of the first light inlet 2, the fourth reflector 19.2 is located at the third reflector 19.1 Bel...

Embodiment 3

[0079] Such as Figure 6As shown, Embodiment 3 of the present application provides a dual-beam coupling water-conducting processing method, including S1: beam combining perforation; S2: coupling cutting.

[0080] Combined piercings include:

[0081] S11: the control module controls the water unit 15 to form a water column 18, controls the vision module to work, and controls the motion module in the beam combining chamber 11 to reset the positions of the first translation platform 8.1 and the second translation platform 8.2 to zero;

[0082] S12: The control module controls two discrete lasers to emit laser A3 and laser B6, modulate the laser A3 and laser B6 into a beam combination laser through the beam combining chamber 11, and couple the beam combining laser into the water column 18 through the coupling chamber 17. The workpiece is combined and perforated;

[0083] S13: The vision module recognizes the progress of the perforation until the formed hole is penetrated, and se...

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Abstract

The invention discloses a double-beam coupling water guide machining head device and a machining method, and belongs to the technical field of water guide laser machining. The problems that existing coupling laser is low in power, output light spot energy is uneven, and visual machining cannot be achieved can be solved. The machining head device comprises a light beam modulation module, a vision module and a control module. The machining method comprises the steps that beam combining and perforating are conducted, specifically, the control module controls two discrete lasers to emit laser A and laser B, the laser A and the laser B are modulated into beam combining laser through a beam combining chamber, the beam combining laser is focused and coupled into a water column through a coupling chamber, and beam combining and perforating are conducted on a workpiece; and coupling and cutting are carried out, the control module receives the translation amount input by a user, sends a control instruction to a motion module, controls a first translation stage and a second translation stage to complete translation according to the translation amount, and focuses and couples the coupled light beams into the water column after passing through the beam combining chamber and the coupling chamber. The device and method are used for punching the thick plate workpiece.

Description

technical field [0001] The invention relates to a double-beam coupled water-guided processing head device and a processing method, belonging to the technical field of water-guided laser processing. Background technique [0002] Water guide laser processing is to use the water column to form an optical waveguide, so that the laser can be totally reflected in the water column, which can be used for laser cutting and drilling. However, for fast cutting with low taper, the existing water-conducting laser processing technology still does not have this ability. The main reasons are as follows: First, the coupling laser power is not high, and it is difficult to penetrate the thick plate directly when cutting the initial perforation. It takes a long time or multiple times of laser removal to penetrate the workpiece, which greatly affects the improvement of cutting speed. At present, this field adopts the method of coupling a single beam into the water column, which leads to the lim...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/06B23K26/067B23K26/38B23K26/70
CPCB23K26/06B23K26/067B23K26/38B23K26/702
Inventor 王吉张文武张广义
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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