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Graphene thermal interface material production device and preparation method thereof

A technology of thermal interface materials and production equipment, applied in the direction of graphene, heat exchange materials, chemical instruments and methods, etc., to achieve low price, excellent thermal conductivity, and improve the quality of finished products

Active Publication Date: 2021-10-15
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, as a typical two-dimensional sheet material, the ultrahigh thermal conductivity of graphene is only shown in the in-plane direction, and its thermal conductivity in the out-of-plane direction is less than 3 W / mK

Method used

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  • Graphene thermal interface material production device and preparation method thereof
  • Graphene thermal interface material production device and preparation method thereof
  • Graphene thermal interface material production device and preparation method thereof

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Embodiment

[0041] see Figure 1-7 , a graphene thermal interface material production device, comprising a fixed frame 1, the upper end of the fixed frame 1 is provided with a transmission box 2, the inner wall of the transmission box 2 is provided with a rotation fixing seat 3, and the rotation fixing seat 3 is provided with a plurality of ring arrays, The center of the transmission box 2 is concentrically provided with a microneedle cutting seat 6, and the lower end of the fixed frame 1 is provided with a drive mechanism 4, the drive mechanism 4 includes an indexing turntable 7 and a synchronous deflection motor 11, and the upper end of the output turntable of the indexing turntable 7 is connected to the microneedle cutting machine. The seat 6 is fixedly connected, and the middle part of the output turntable is rotated with a synchronous chassis 5, the synchronous chassis 5 and the rotation fixed seat 3 are connected through a synchronous deflection transmission mechanism 10, and the low...

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Abstract

The invention discloses a graphene thermal interface material production device and a preparation method thereof, and belongs to the technical field of thermal interface materials. The graphene thermal interface material production device comprises a fixing frame, a transmission box is arranged at the upper end of the fixing frame, and autorotation fixing bases are arranged on the inner wall of the transmission box; a plurality of autorotation fixing seats are arranged in an annular array, a microneedle cutting base is concentrically arranged in the center of the transmission box, a driving mechanism is arranged at the lower end of the fixing frame and comprises an indexing rotary table and a synchronous deflection motor, and the arranged indexing rotary table drives the microneedle cutting base to periodically rotate, The microneedle cutting base drives a microneedle assembly to perform microneedle cutting on the two-dimensional nanosheet dispersion liquid coated on the thermal interface substrate, the thermal interface material with high vertical orientation is prepared, the thermal interface material is subjected to microneedle cutting to form a radial structure, and the device is low in price, simple in process, suitable for large-scale continuous production and suitable for industrial amplification application.

Description

technical field [0001] The invention relates to the technical field of thermal interface material production, and more specifically, to a graphene thermal interface material production device and a preparation method thereof. Background technique [0002] With the development of electronic packaging towards miniaturization, integration, and intelligence, the power density per unit area inside electronic devices has also risen sharply. If the heat generated by electronic products cannot be discharged in time, it will greatly affect the working performance and service life of the chip. Efficient thermal management design is the key to solving this problem. The core is to prepare heat sinks with high vertical thermal conductivity. The interface material is filled between the heat source and the heat sink to reduce the interface thermal resistance, so that heat can be quickly transferred from the heat source to the heat sink. At present, the content of thermally conductive fill...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14C01B32/184
CPCC09K5/14C01B32/184
Inventor 高超沈颖曹敏
Owner ZHEJIANG UNIV
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