Water cooling system simulation device

A simulation device and water-cooling system technology, applied in the direction of measuring devices, instruments, machine/structural component testing, etc., can solve the problems of slow flow of high-temperature gas, limited range of heat absorption coverage, and reduce the accuracy of water-cooling simulation, etc., to achieve The effect of ensuring accuracy, preventing the loss of high-temperature gas, and improving the heat conduction effect

Pending Publication Date: 2021-10-08
HEBEI SUNTIEN NEW ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the existing water-cooling system simulation device simulates the water-cooling effect, it generally places the heat absorber of the water-cooling device in a closed storage frame filled with high-temperature gas, and obtains The water cooling effect of the water cooling device, however, the heat absorber is placed in the storage frame, and its heat absorption coverage is limited. The area that cannot be covered will cause the high temperature gas to flow slowly, affect the overall heat absorption efficiency, and reduce the accuracy of the water cooling simulation. sex

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] refer to Figure 1-4 , a water-cooling system simulation device, comprising a bottom plate 1 and a storage frame 7, a through hole is opened on one side of the outer wall of the storage frame 7, and a concentrated heat transfer ring 19 is fixedly connected to the inner wall of the storage frame 7 near the through hole, and the concentrated heat transfer ring The outer wall of 19 is fixedly connected with heat conduction plate 17 equidistantly, and the outer wall of heat conduction plate 17 has heat conduction holes 18 at equal distances, the outer wall of storage frame 7 located outside the through hole is fixedly connected with sealing sleeve 13, and the top outer wall of bottom plate 1 is fixedly connected with Two chutes 16, and the inner walls of the two chutes 16 are slidingly connected with sliders 15, and the two sliders 15 are fixedly connected to the bottom outer wall of the storage frame 7. When performing water cooling simulation, the heat absorber and the cen...

Embodiment 2

[0034] refer to Figure 1-5 , a water-cooling system simulation device, comprising a bottom plate 1 and a storage frame 7, a through hole is opened on one side of the outer wall of the storage frame 7, and a concentrated heat transfer ring 19 is fixedly connected to the inner wall of the storage frame 7 near the through hole, and the concentrated heat transfer ring The outer wall of 19 is fixedly connected with heat conduction plate 17 equidistantly, and the outer wall of heat conduction plate 17 has heat conduction holes 18 at equal distances, the outer wall of storage frame 7 located outside the through hole is fixedly connected with sealing sleeve 13, and the top outer wall of bottom plate 1 is fixedly connected with Two chutes 16, and the inner walls of the two chutes 16 are slidingly connected with sliders 15, and the two sliders 15 are fixedly connected to the bottom outer wall of the storage frame 7. When performing water cooling simulation, the heat absorber and the cen...

Embodiment 3

[0043] refer to Figure 1-5 , a water-cooling system simulation device, comprising a bottom plate 1 and a storage frame 7, a through hole is opened on one side of the outer wall of the storage frame 7, and a concentrated heat transfer ring 19 is fixedly connected to the inner wall of the storage frame 7 near the through hole, and the concentrated heat transfer ring The outer wall of 19 is fixedly connected with heat conduction plate 17 equidistantly, and the outer wall of heat conduction plate 17 has heat conduction holes 18 at equal distances, the outer wall of storage frame 7 located outside the through hole is fixedly connected with sealing sleeve 13, and the top outer wall of bottom plate 1 is fixedly connected with Two chutes 16, and the inner walls of the two chutes 16 are slidingly connected with sliders 15, and the two sliders 15 are fixedly connected to the bottom outer wall of the storage frame 7. When performing water cooling simulation, the heat absorber and the cen...

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Abstract

The invention belongs to the technical field of water cooling device simulation detection, and particularly relates to a water cooling system simulation device. In the prior art, when an existing water-cooling system simulation device simulates a water-cooling effect, the heat absorber of a water-cooling device is generally placed in a closed storage frame filled with high-temperature gas, the water-cooling effect of the water-cooling device is obtained by recording temperature changes in the storage frame in unit time, however, when the heat absorber is placed in the storage frame, the heat absorption coverage range is limited, and the area which cannot be covered can cause the slow flowing speed of high-temperature gas. A purpose of the invention is to solve the problem in the prior art. According to the technical scheme of the invention, the device comprises a bottom plate and a storage frame. According to the invention, by arranging a concentrated heat transfer ring and a heat conducting plate, when water cooling simulation is carried out, a heat absorber is in contact with the concentrated heat transfer ring, then heat on each space point in a storage frame is transferred to the concentrated heat transfer ring through the heat conducting plate, and the heat is absorbed by a radiator, so that the heat absorption of the heat absorber is ensured to be maximized, and the accuracy of data obtained by the water-cooling simulation device is ensured.

Description

technical field [0001] The invention relates to the technical field of detection of simulation rolls of water cooling devices, in particular to a simulation device of a water cooling system. Background technique [0002] The water-cooled heat dissipation system uses a pump to circulate the coolant in the heat pipes and dissipate heat. The heat-absorbing part on the radiator (called the heat-absorbing box in the liquid cooling system) is used to absorb heat from the computer CPU, north bridge, and graphics card; the heat absorbed by the heat-absorbing part is discharged through the radiator designed on the back of the fuselage. To the outside of the host, a simulation device is needed when simulating the water cooling effect of the water cooling system. [0003] When the existing water-cooling system simulation device simulates the water-cooling effect, it generally places the heat absorber of the water-cooling device in a closed storage frame filled with high-temperature ga...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01M99/00
CPCG01M99/002G01M99/008
Inventor 沙济通胡占飞钟明伟张峰艾其
Owner HEBEI SUNTIEN NEW ENERGY TECH
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