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Conductive paste, and preparation method and application thereof

A technology of conductive paste and tin-bismuth, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve the problems of increasing electrode series resistance and unfavorable use, and achieve increased conductivity access, cost savings, migration mitigation effects

Inactive Publication Date: 2021-09-21
中硕实业(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Since the particle size of the silver powder used in the preparation of low-temperature conductive paste is in the micron range, the series resistance of the electrode is increased, which is not conducive to the use

Method used

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  • Conductive paste, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0041] This preparation example provides a kind of tin-bismuth-silver alloy-coated spherical silver powder (based on the sum of the mass of each preparation raw material being 100wt%), the preparation method is as follows:

[0042] Get 30wt% tin-bismuth-silver alloy (the molar percentage of tin is 69%, the molar percentage of bismuth is 28%, the molar percentage of silver is 3%) melting, then add 70wt% spherical silver powder (particle size between 0.05-0.8 μm) , after stirring, pressurize the melting reactor with nitrogen, press the material to the spray granulation tower, and adopt the airflow spray granulation method for granulation. The process parameters of spray granulation: the inlet temperature is 200 °C, and the feeding rate is 10mL / min, the spray gas flow rate is 28m 3 / h, the tin-bismuth-silver alloy-coated spherical silver powder is obtained after spray granulation.

preparation example 2

[0044] This preparation example provides a kind of tin-bismuth-silver alloy-coated spherical silver powder (based on the sum of the mass of each preparation raw material being 100wt%), the preparation method is as follows:

[0045] Get 10wt% tin-bismuth-silver alloy (the molar percentage of tin is 86%, the molar percentage of bismuth is 13%, the molar percentage of silver is 1%) melting, then add 90wt% spherical silver powder (particle size between 0.05-0.8 μm) , after stirring, pressurize the melting reactor with nitrogen, press the material to the spray granulation tower, and adopt the airflow spray granulation method for granulation. The process parameters of spray granulation: the inlet temperature is 200 °C, and the feeding rate is 10mL / min, the spray gas flow rate is 28m 3 / h, the tin-bismuth-silver alloy-coated spherical silver powder is obtained after spray granulation.

preparation example 3

[0047] This preparation example provides a kind of tin-bismuth-silver alloy-coated spherical silver powder (based on the sum of the mass of each preparation raw material being 100wt%), the preparation method is as follows:

[0048] Get 70wt% tin-bismuth-silver alloy (the molar percentage of tin is 50%, the molar percentage of bismuth is 47%, the molar percentage of silver is 3%) melting, then add 30wt% spherical silver powder (particle size between 0.05-0.8 μm) , after stirring, pressurize the melting reactor with nitrogen, press the material to the spray granulation tower, and adopt the airflow spray granulation method for granulation. The process parameters of spray granulation: the inlet temperature is 200 °C, and the feeding rate is 10mL / min, the spray gas flow rate is 28m 3 / h, the tin-bismuth-silver alloy-coated spherical silver powder is obtained after spray granulation.

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Abstract

The invention provides a conductive paste, and a preparation method and application thereof. The conductive paste comprises the following components in parts by weight: 55-65 parts of a flaky silver powder, 24-28 parts of a tin-bismuth-silver alloy coated spherical silver powder, 3-9 parts of an organic binder and 2-8 parts of an organic carrier. The conductive paste provided by the invention is good in conductive effect and strong in adhesive force.

Description

technical field [0001] The invention belongs to the field of conductive materials, and in particular relates to a conductive paste and its preparation method and application, in particular to a conductive paste with good conductive effect and its preparation method and application. Background technique [0002] With the rapid development of the electronics industry, conductive paste, as an electronic material, has been widely used in the preparation of electronic devices and optoelectronic devices. Wherein, the low-temperature curable conductive paste refers to a type of conductive paste cured at a relatively low temperature (100-200° C.). [0003] Low temperature curable conductive paste is generally composed of conductive phase, binder phase, organic vehicle and additives. Among them, the conductive phase is the main component of the conductive paste, which provides the conductivity of the conductive paste; the binder phase ensures good bonding between the electrode and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00B22F1/00B22F1/02B22F9/08C22C13/02
CPCH01B1/22H01B13/00B22F9/082C22C13/02
Inventor 王立惠陈同祥耿小红吴博竞吴迎港李硕
Owner 中硕实业(上海)有限公司
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