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Display substrate and preparation method thereof, display panel and display device

A technology for display substrates and display areas, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as affecting the output capability of the driver chip IC, large impedance of the connecting line, affecting the display effect of the display panel, etc., to improve stability and reliability. performance, reduce impedance, and ensure the effect of driving ability

Pending Publication Date: 2021-08-24
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the shortcomings of the existing methods, the present application proposes a display substrate and its preparation method, a display panel, and a display device to solve the problem that the existing technology has a large impedance of the connecting line and affects the output capability of the driver chip IC. Technical problems with the display effect of the display panel

Method used

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  • Display substrate and preparation method thereof, display panel and display device
  • Display substrate and preparation method thereof, display panel and display device
  • Display substrate and preparation method thereof, display panel and display device

Examples

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Embodiment Construction

[0070] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0071] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

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Abstract

The embodiment of the invention provides a display substrate and a preparation method thereof, a display panel and a display device. The display substrate comprises a display area and a peripheral area at least located on one side of the display area; a plurality of data line leads, positioned in the peripheral area and electrically connected with the plurality of data lines; first binding pins, located on the sides, away from the display area, of the data line leads and connected with the data line leads; a second binding pin, located in the peripheral area and located on the side, away from the display area, of the first binding pin; and a connecting line, located between the first binding pin and the second binding pin and connected with the first binding pin and the second binding pin, and the connecting line comprising at least two conductive layers which are electrically connected in parallel. According to the embodiment of the invention, the connecting line comprises at least two conductive layers which are connected in parallel and electrically connected, so that the impedance of the connecting line is effectively reduced, the driving capability of the driving chip is ensured, the stability and reliability of display of the display panel are improved, and the display effect of the display panel is ensured.

Description

technical field [0001] The present application relates to the field of display technology, in particular, the present application relates to a display substrate and a preparation method thereof, a display panel, and a display device. Background technique [0002] With the continuous improvement and optimization of OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) technology, OLED products have shown huge market potential, and their excellent display performance makes them have a wide range of application space. At the same time, technological development also affects the reliability of the screen. Sexuality puts forward higher demands. [0003] There are two types of IC packaging methods for the driver chip of the existing flexible OLED products: COP (chip on plastic) & COF (Chip OnFlex, or, Chip On Film, chip on film). For COP products, ILB (inner leadbonding, internal introduction Foot bonding) connecting wires to overlap the flexible circuit board FPC and...

Claims

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Application Information

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IPC IPC(8): H01L27/32
CPCH10K59/40H10K59/1315H10K59/1201
Inventor 屈忆张波初志文王欣欣冯翱远
Owner BOE TECH GRP CO LTD
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