Thermally conductive composite filler, high thermally conductive composite material and preparation method thereof

A technology of composite materials and thermally conductive fillers, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of high cost, low thermal conductivity, high density, etc.

Active Publication Date: 2022-08-09
NORTHEAST GASOLINEEUM UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the currently reported polymer composites require high filler loadings (>50 vol%) to achieve the targeted high thermal conductivity (~10 W / m K), and even then, their thermal conductivity is still lower than that of metals and alloys.
Moreover, such a high filler loading has problems such as high cost and high density, and it is difficult to meet the needs of current industrial applications.

Method used

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  • Thermally conductive composite filler, high thermally conductive composite material and preparation method thereof
  • Thermally conductive composite filler, high thermally conductive composite material and preparation method thereof
  • Thermally conductive composite filler, high thermally conductive composite material and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0046] At present, the commonly used preparation methods of high thermal conductivity composite materials are to mix thermally conductive fillers with three-dimensional structures with polymers by direct mixing (melt kneading, direct mechanical mixing, etc.).

[0047] However, these direct mixing methods destroy the original three-dimensional structure of the thermally conductive fillers (due to the lack of support inside the three-dimensional fillers), such as compressing the three-dimensional structure into a two-dimensional structure, reducing the contact area between the thermally conductive fillers, and the interior of the three-dimensional structure of the thermally conductive fillers. The pores or gaps are very small, usually micron or even nanoscale. Direct mixing can easily cause the polymer to be insufficiently filled inside the thermally conductive filler and leave air, resulting in an unsatisfactory thermal conductivity improvement rate, which further leads to the th...

Embodiment 1

[0074] Step (1): 5.7g of expanded graphite, 0.1g of graphene, 1.7g of nano-alumina and 7.5g of polyphenylene sulfide are placed in dimethylformamide, stirred evenly, heated to 155°C to remove dimethylformamide, and obtained Thermally conductive composite filler.

[0075] Step (2): put the thermally conductive composite filler obtained in step (1) and 10g of polyphenylene sulfide in a material cup, and stir and strengthen the mixing by planetary stirring to obtain a mixture;

[0076] Step (3): The mixture is placed in different molds and hot-pressed. Hot pressing conditions: temperature 160℃~260℃, heat preservation for 35min; pressurization once, pressure 19MPa, pressure relief after 0.5min; secondary pressurization, pressure 19MPa, pressure relief after holding pressure for 3.5min; pressurization three times, pressure relief 19MPa, pressure relief after 11min holding pressure; four times of pressure, pressure 19MPa, pressure relief after holding pressure for 40min. Cooling t...

Embodiment 2

[0078] Step (1): 2.4g of expanded graphite, 0.1g of nano-silicon carbide and 12.5g of polyethersulfone are placed in dimethylformamide and stirred evenly, heated to 155° C. to remove dimethylformamide to obtain a thermally conductive composite filler.

[0079] Step (2): The thermally conductive composite filler obtained in step (1) and 10g of polyethersulfone are placed in a material cup, and planetary stirring is strengthened to mix to obtain a mixture;

[0080] Step (3): The mixture is placed in different molds and hot-pressed, and the hot-pressing conditions are the same as those of Comparative Example 1. Cooling to obtain a high thermal conductivity composite material.

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Abstract

The invention discloses a thermally conductive composite filler, a high thermally conductive composite material and a preparation method thereof. The thermally conductive composite filler comprises a first thermally conductive filler, the first thermally conductive filler has a three-dimensional structure; the second thermally conductive filler and a polymer are adhered on The inner surface of the first thermally conductive filler; the high thermally conductive composite material includes the thermally conductive composite filler; the problem that the current high thermally conductive composite material requires a high filler filling amount to obtain a target high thermal conductivity.

Description

technical field [0001] The present disclosure relates to the field of high thermal conductivity new materials or composite materials, in particular to a thermally conductive filler, a high thermal conductivity composite material and a preparation method thereof. Background technique [0002] Inefficient heat dissipation will limit the reliability and lifetime of equipment components used in thermal management. And with the rapid development of modern equipment towards high integration, high power density, light weight and miniaturization, this problem has become more and more serious. Therefore, high-efficiency heat dissipation of equipment has become an urgent need. Polymers are widely accepted for their light weight, ease of processing and low cost. However, most polymers have low thermal conductivity (0.1–0.5 W / m·K) and cannot be directly applied in the field of thermal management. [0003] In order to improve the thermal conductivity of polymers, it is usually necessa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K7/24C08K3/04C08K3/22C08L81/02C08K3/34C08L81/06C08L77/06C08L27/16C08K3/08C08K7/06C09K5/14
CPCC08K7/24C08K3/042C08K3/22C08L81/02C08K3/34C08L81/06C08L77/06C08K3/041C08L27/16C08K3/08C08K7/06C08K3/04C09K5/14C08K2201/011C08K2003/2227C08K2003/0806C08K2003/085Y02E60/10
Inventor 汪怀远包迪朱艳吉王精一李美玲袁瑞霞
Owner NORTHEAST GASOLINEEUM UNIV
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