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Packaging process of back surface pre-etched packaging structure

A technology of packaging technology and packaging structure, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., and can solve problems such as the inability to install size chips, environmental pollution, and product deviation.

Inactive Publication Date: 2021-07-30
江阴苏阳电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current FBP packaging process is: after the front side of the metal substrate is etched, then the back side is etched. The shape of the back side is limited by the shape of the front side. When the pins are subsequently tinned, due to the cohesive force of tin, the entire product may deviate. The pins generally need to be set to a uniform size in order to keep the product balanced. Therefore, the existing lead frame cannot accommodate larger chips, resulting in the limitation of the chip size of the existing lead frame.
[0003] The existing process still has the following problems: multiple chemical etching brings environmental pollution problems, and the packaging efficiency is low, all of which require a new packaging process to solve the above problems

Method used

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Examples

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Embodiment 1

[0043] see Figure 1~Figure 10 , the packaging process of a backside pre-etched packaging structure in this embodiment, the packaging process method includes the following steps:

[0044] Step 1. Take the metal substrate

[0045] see figure 1 , take a piece of metal substrate with appropriate thickness. The purpose of this plate is to provide support for circuit production and circuit layer structure. The material of this plate is mainly metal material, and the material of metal material can be copper, iron, stainless steel materials or other conductive metal substances;

[0046] Step 2. Pre-plating copper layer on the surface of the metal substrate

[0047] see figure 2 , pre-plating a copper layer on the surface of the metal substrate, the thickness of the copper layer is 2 to 10 microns, the preparation method can be chemical deposition, electrodeposition or vapor deposition, for the conductivity of the subsequent electroplating process;

[0048] Step 3: Photolithogra...

Embodiment 2

[0065] see Figure 12~22 , the packaging process of a backside pre-etched packaging structure in this embodiment, the difference between this embodiment and Embodiment 1 is:

[0066] Add a step between step 8 and step 9: coat a layer of insulating layer, such as green paint, on the back of the metal substrate that has been etched on the back of step 8. see Figure 11 .

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Abstract

The invention relates to a packaging process of a back surface pre-etched packaging structure. Chemical etching is carried out on the front surface and the back surface of a metal substrate at the same time, the back surface position and the front surface etching position can be staggered, and the back surface etching shape and size are not limited, so that a fixed shape and depth can be obtained by etching on the back surface according to product needs, customization can be carried out according to needs, the problem that the size of an existing chip is limited is solved, and a large-size chip can be mounted on the front surface. By means of back surface pre-etching, the etching precision is improved, the subsequent etching time and difficulty are reduced, the packaging efficiency is improved, the waste copper discharge is reduced, the environment is protected, and the energy is saved.

Description

technical field [0001] The invention relates to a packaging process of a backside pre-etched packaging structure, which belongs to the technical field of semiconductor packaging. Background technique [0002] Flat bump package FBP (Flat Bump Package) is a new type of package, which is a new design solution for some problems that cannot be fundamentally solved by QFN (Quad Flat No-lead) in the packaging process. The current FBP packaging process is: after the front side of the metal substrate is etched, then the back side is etched. The shape of the back side is limited by the shape of the front side. When the pins are subsequently tinned, due to the cohesive force of tin, the entire product may deviate. The pins generally need to be set to a uniform size in order to keep the product balanced. Therefore, the existing lead frame cannot accommodate a chip with a larger size, resulting in the limitation of the chip size of the existing lead frame. [0003] The existing process ...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L21/56H01L23/495
CPCH01L23/3121H01L21/561H01L23/49541H01L23/49548H01L2224/73265H01L2224/32245H01L2224/48091H01L2224/48247H01L2924/181H01L2224/97H01L2924/00012H01L2924/00014
Inventor 吴奇斌吴莹莹李华
Owner 江阴苏阳电子股份有限公司
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