Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Bonding device and automatic remodeling method

A technology of the original pressure device and pressure head, which is applied in the direction of assembling printed circuits, instruments, printed circuits, etc. of electric components, which can solve the problems of inconvenient change and low efficiency of change, achieve accurate bonding position and improve change efficiency , Reduce the effect of manual debugging errors

Pending Publication Date: 2021-07-30
SHENZHEN LIANDE AUTOMATION EQUIP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a local pressure device for the problems of inconvenient changeover and low changeover efficiency of the existing pressure device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bonding device and automatic remodeling method
  • Bonding device and automatic remodeling method
  • Bonding device and automatic remodeling method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0039] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counte...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a bonding device and an automatic remodeling method based on the bonding device. The bonding device comprises a pressing head mechanism and a remodeling mechanism which are arranged at intervals in the vertical direction, wherein the pressing head mechanism comprises multiple sets of pressing head assemblies arranged at intervals, the remodeling assembly can be selectively connected with the multiple pressing head assemblies, the initial position and the target position of each pressing head assembly can be obtained, and a second driving piece drives the remodeling mechanism to move in the first direction, so that the multiple pressing head assemblies can be moved to the corresponding target positions in sequence, hot-pressing bonding can be conducted on products of different sizes and types, production and machining of various products are achieved, the universality of the bonding device is improved, the positions of the pressing head assemblies do not need to be adjusted many times, the remodeling efficiency can be improved, manual operation is not needed so as to reduce manual debugging errors, the bonding position accuracy of the pressing head assembly is ensured, and the remodeling precision and the production efficiency are improved.

Description

technical field [0001] The invention relates to the technical field of liquid crystal module production, in particular to a pressure device and an automatic type change method. Background technique [0002] This pressing process refers to the process of pressing the flexible printed circuit board and the glass panel, or the flexible printed circuit board and the printed circuit board through the pressure head at a certain temperature and a certain pressure, so that they are closely attached together. A process. [0003] With the continuous development of the liquid crystal display module and touch screen field, the society's demand for related products is also increasing, and the production and processing mode of multiple sets of indenters working in parallel came into being. When the existing pressing device is hot-pressing products, when it is necessary to process products of different sizes or types, it is necessary to adjust the bonding position of the indenter several ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G02F1/13H05K3/36
CPCG02F1/1303H05K3/365Y02P70/50
Inventor 赖太辛刘思文杨彬黄浩张升玉
Owner SHENZHEN LIANDE AUTOMATION EQUIP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com