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LED screen comprehensive packaging system and packaging method thereof

A packaging system and comprehensive technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as low work efficiency, and achieve the effect of reducing costs and reducing human-assisted participation.

Active Publication Date: 2021-07-27
重庆新视通智能科技有限公司
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0003] The existing LED screen comprehensive packaging method usually uses manual placement of the injection mold on the glue filling table, then puts the LED raw material into the mold cavity of the mold, finally covers the mold cover, and finally pours water into the mold Wrapping the chip and the bracket, this packaging method requires more steps of manual participation, requires continuous manual auxiliary processing, and the work efficiency is relatively low

Method used

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  • LED screen comprehensive packaging system and packaging method thereof
  • LED screen comprehensive packaging system and packaging method thereof
  • LED screen comprehensive packaging system and packaging method thereof

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Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0037] see Figure 1-11 , the present invention proposes a technical solution, a comprehensive packaging system for LED screens, including a displacement structure 10, a glue injection workbench 1 is arranged under the displacement structure 10, and a raw material conveyor 8 is arranged on one side of the glue injection workbench 1, The LED raw material 6 is placed on the conveyor belt of the raw material conveyor 8, and the top cover conveyor 9 is arranged be...

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Abstract

The invention discloses an LED screen comprehensive packaging system and a packaging method thereof. The LED screen comprehensive packaging system comprises a displacement structure, a glue injection workbench is arranged below the displacement structure, and a raw material conveyor is arranged at one side of the glue injection workbench; LED raw materials are placed on a conveying belt of the raw material conveyor, a top cover conveyor is arranged at the side, close to the LED raw material, of the rear portion of the glue injection workbench, a glue injection mold top cover is placed on a conveying belt of the top cover conveyor, and a support conveyor is arranged at the side, close to the LED raw material, of the front portion of the glue injection workbench. According to the LED screen comprehensive packaging system and the packaging method thereof, the mechanical automatic feeding is achieved, continuous manual feeding operation is not needed, manual auxiliary participation links are effectively reduced, the grabbing and placing operations of three different types of workpieces can be completed through one clamping structure, the coordinated use of multiple manipulators is not needed, and the use and manufacturing cost is reduced.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to a comprehensive LED screen packaging system and a packaging method thereof. Background technique [0002] The LED display is a flat-panel display, which is composed of small LED module panels and is used to display various information such as text, images, and videos. LED electronic display integrates microelectronics technology, computer technology, and information processing, and has the advantages of bright colors, wide dynamic range, high brightness, long life, stable and reliable work, etc. LED displays are widely used in commercial media, cultural performance markets, stadiums, information dissemination, press releases, securities transactions, etc., and can meet the needs of different environments. In the process of LED packaging, it is necessary to fill the chip and the bracket with glue to wrap them, and then bake them for a long time. [0003] The existing LED screen comprehensive...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52H01L27/15
CPCH01L33/48H01L33/52H01L27/156H01L2933/0033H01L2933/005
Inventor 孙雪芹
Owner 重庆新视通智能科技有限公司
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