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Novel coupling cooling device based on ionic wind, cooling method and application thereof

A cooling device, ion wind technology, applied in cooling/ventilation/heating transformation, modification using liquid cooling, electrical components, etc., can solve the problem of inability to meet the heat consumption requirements of electronic equipment, etc., to improve the evaporation rate of the liquid film, increase the The effect of large near-wall convection heat transfer coefficient and accelerated phase transfer heat

Active Publication Date: 2021-07-23
CHINA UNIV OF PETROLEUM (EAST CHINA)
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, due to the limitations of heat dissipation technology and heat dissipation methods, most of the natural cooling systems on the market cannot meet the increasing heat consumption requirements of electronic equipment.

Method used

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  • Novel coupling cooling device based on ionic wind, cooling method and application thereof
  • Novel coupling cooling device based on ionic wind, cooling method and application thereof
  • Novel coupling cooling device based on ionic wind, cooling method and application thereof

Examples

Experimental program
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Embodiment

[0075] (1) Brief description

[0076] In order to facilitate the implementation of numerical simulation, the above-mentioned EHD strengthening ion-based new coupling cooling device is further simplified, physical models such as Image 6 As shown, the left side of the casing 1 cavity is a speed inlet, and the right side of the casing 1 cavity is a pressure outlet. The ion wind generator 5 and the receiving pole 9 are arranged in the study area, and there is a thermal current density Q at the bottom surface of the heat sink. The constant heat flow is present in a filling coolant 4 having a liquid surface height between the heat sink metal heat dissipating fins 3. It is assumed that the inlet flow rate is U, the temperature of 293.15k, the relative humidity is 0, the ion wind generator 5 voltage is V 0 The heat flow accelerates under the EHD effect, since the dry gas rapid purity absorbs a metal heat dissipating fin 3 gap of the coolant 4, and a severe thermal excitation process occur...

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Abstract

The invention discloses a novel coupling cooling device based on ionic wind, a cooling method and application thereof. The bottom of a shell is provided with a uniform temperature plate substrate in contact with a heat source, the uniform temperature plate substrate is vertically provided with a plurality of metal radiating fins at intervals, and a flow channel is formed between every two adjacent metal radiating fins; the bottom side of the interior of the shell is filled with cooling liquid, and the cooling liquid is evenly distributed in the flow channel; an ionic wind generator is arranged at the front part of the shell and comprises a high-voltage power supply, a plurality of electrodes and an electrode support; the plurality of electrodes are fixed on the electrode support at equal intervals, and the plurality of electrodes are electrically connected to the high-voltage power supply; and a receiving electrode made of a stainless steel wire mesh material is arranged at the rear part of the shell and is attached to the side wall of the rear part of the shell. The invention creatively provides a novel heat exchanger combining electrohydrodynamics and phase-change heat exchange, and organic coupling of two heat exchange modes of increasing convective heat exchange in the metal radiating fins and phase-change heat exchange at the roots of the metal radiating fins 3 is realized.

Description

Technical field [0001] The present invention relates to the field of heat dissipation techniques of electronic components, in particular, a new type of coupling cooling device, cooling method, and application thereof based on ion wind. Background technique [0002] With the rapid development of the electronics industry, compliance with Moore's regular trends, electronic equipment has become more and more powerful, high-power, high integration direction, and the thermal density of the system is getting bigger and larger, and environmental adaptability is getting higher and higher. The volume is getting smaller and smaller, the heat dissipation of electronic equipment has gradually become a bottleneck that curbs the development of the electronics industry. [0003] The heat dissipation system of the electronic device is usually divided into two types of active heat dissipation and passive heat dissipation. Active heat dissipation usually uses a strong wind cooling or water-cooled s...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20309H05K7/208
Inventor 董晓真徐周云刘桂志李顺焦寿杰刘娣
Owner CHINA UNIV OF PETROLEUM (EAST CHINA)
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