Turnover mechanism for packaging plastic package diode and implementation method of turnover mechanism

Abstract

The invention discloses a turnover mechanism for packaging a plastic package diode and an implementation method of the turnover mechanism. The overturning mechanism comprises a first conveying belt and a second conveying belt, an overturning support is arranged between the first conveying belt and the second conveying belt, moving wheels are symmetrically connected to the two ends of the overturning support, threaded holes are formed in the portion, between the moving wheels, of the overturning support. A fixing base plate is meshed in the threaded hole, a supporting plate is fixedly connected to the middle position of the upper surface of the overturning support, and an overturning device is connected to the upper end of the supporting plate. According to the overturning mechanism for packaging the plastic-packaged diode and the implementation method of the overturning mechanism, the arc-shaped support is arranged in the through hole, the gravity of the discharging piece and the spherical supporting block is used for pushing the arc-shaped support to move, the supporting spring plays a buffering role, the discharging piece is slowly overturned to be connected with the movable roller, and the situation that the overturning speed is too high, and the discharging piece is damaged is avoided. And meanwhile, the influence of resistance on the blanking piece in the overturning process is reduced, the operation is safe, and the overturning is reliable.

Description

technical field [0001] The invention relates to the technical field of diode packaging, in particular to a flipping mechanism for plastic-encapsulated diode packaging and an implementation method thereof. Background technique [0002] Diode, also known as crystal diode, is an electronic device capable of conducting current in one direction. It usually includes two T-shaped pins and a semiconductor chip between the two pins. The big end of the T-shaped pin is the head, and the small end is the head. One end of the head is the tail, and the heads of the two pins face each other, and the pins and the two poles of the chip can be connected by solder sheets. The existing overturning mechanism used for diode packaging has the following problems in use: 1. When the lower material is adsorbed, it is often adsorbed by a block-shaped object with a number of small holes at the bottom, and it is also necessary to use a suction Pipes are easy to cause pipe entanglement during use, and s...

AI Technical Summary

Problems solved by technology

The existing overturning mechanism used for diode packaging has the following problems in use: 1. When the lower material is adsorbed, it is often adsorbed by a block-shaped object with a number of small holes at the bottom, and it is also necessary to use a suction The pipes are easy to cause the pipes to be entangled during use, and sometimes the small holes at the bottom may cause air leakage and cannot be adsorbed; 2. The overall structure of the device is relatively complicated, and the manufacturing and maintenance costs are correspondingly high, and the lower material is relocated after being turned over more difficult to operate

[0004] Although this application solves the problems in the background technology to a certain extent, the suction cup in this application needs to continuously start and stop the conveyor belt during the adsorption process, which brings certain difficulties to the operation and affects the service life of the conveyor belt. In addition, the motor controls one end of the flip plate Realize turning over, when starting and stopping, one end of the turning plate exerts a large torque on the motor, and the motor only rotates 180°, and the motor is seriously worn out after long-term use

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