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Laser perforation processing method for a thick plate

A laser perforation and processing method technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as inability to perforate, unstable perforation, and inability to realize full board cutting, and achieve the effect of improving work efficiency

Active Publication Date: 2022-03-15
JIANGSU YAWEI MACHINE TOOL
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

At present, when laser nitrogen cutting is performed on thick stainless steel plates, if the cutting limit plate thickness is reached, the perforation is unstable or even impossible to perforate, which will lead to the inability to realize the whole plate cutting

Method used

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  • Laser perforation processing method for a thick plate

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Effect test

Embodiment Construction

[0019] A thick plate laser perforation processing method, comprising the following steps:

[0020] Step 1: Read the initial piercing parameters: piercing frequency A1, piercing duty cycle B1, gas type C1, gas pressure D1, gas outlet delay E1, cutting nozzle gap F1, piercing power G1, piercing delay H1 and focus position I1;

[0021] Step 2: Read the target piercing parameters: piercing frequency A2, piercing duty cycle B2, gas type C2, gas pressure D2, gas outlet delay E2, cutting nozzle gap F2, piercing power G2, piercing delay H2 and focus position I2 ;

[0022] Step 3: Read target piercing parameters: piercing frequency A3, piercing duty cycle B3, gas type C3, gas pressure D3, gas outlet delay E3, cutting nozzle gap F3, piercing power G3, piercing delay H3 and focus position I3 ;

[0023] Step 4: Adjust the focus, set the focus to I1, set the perforation gas: C1, perforation air pressure: D1, gas output delay: E1, cutting nozzle gap F1 and perforation power G1, and then ...

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Abstract

The invention relates to a thick plate laser perforation processing method. It includes the following steps: first read the initial perforation parameters and read the target, then adjust the focus, adjust the focus to I1, I2 and I3, set the corresponding perforation gas, perforation air pressure, gas outlet delay, cutting nozzle gap and perforation Power, close the gate, determine whether to cut a small circle, if it cuts a small circle, call the cutting small circle parameter to complete the small circle cutting; determine whether to burn slag, call the burning slag parameter, complete the burning slag; call the cutting parameter, open the follow-up, Call the blind zone function to start cutting. The processing method of the invention can solve the perforation problem of the extreme stainless steel plate, thereby realizing the whole plate cutting, ensuring the smooth progress of the whole plate cutting, and improving the working efficiency.

Description

technical field [0001] The invention relates to a processing method, in particular to a thick plate laser perforation processing method, which belongs to the technical field of laser cutting. Background technique [0002] Laser cutting uses a focusing lens to focus the laser beam on the surface of the material to melt the material and at the same time use the coaxial compressed gas of the laser beam to blow away the melted slag, and make the laser beam and the material move relative to each other along a certain trajectory, so that Form a certain slit to achieve laser cutting; but all cutting must be formed after the plate is perforated; in other words, if the cutting stability is good, perforation is the first part; so perforation plays a very important role in laser cutting Status, it affects the effect of cutting, the efficiency of production, and the stability of cutting. At present, when laser nitrogen cutting is performed on thick stainless steel plates, if the limit ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/382B23K103/04
CPCB23K26/382B23K2103/05
Inventor 丁庆伟黎兴宝沈店祥吴许祥戴树晶凌步军王成于娟
Owner JIANGSU YAWEI MACHINE TOOL
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