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Filter Power Divider Based on Integrated Substrate Gap Waveguide

A gap waveguide and integrated substrate technology, applied in the electronic field, can solve the problems of narrow bandwidth of filter power splitter and unsuitable high-frequency band, etc., and achieve the effect of high isolation and wide bandwidth

Active Publication Date: 2022-01-11
YUNNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a filter power divider based on an integrated substrate gap waveguide to solve the problem that the existing filter power divider has a narrow bandwidth and is not suitable for high frequency bands

Method used

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  • Filter Power Divider Based on Integrated Substrate Gap Waveguide
  • Filter Power Divider Based on Integrated Substrate Gap Waveguide
  • Filter Power Divider Based on Integrated Substrate Gap Waveguide

Examples

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Effect test

Embodiment 1

[0064] In Embodiment 1 of the present invention, as Figure 1 to Figure 6 As shown, the filter power divider based on the integrated substrate gap waveguide includes an electromagnetic bandgap structure for shielding electromagnetic radiation energy, a filter power divider structure for energy transmission, an upper dielectric board 1, a lower dielectric board 3, and upper and lower dielectric boards. The middle layer dielectric board 2 that acts as a spacer between the layer dielectric boards, the electromagnetic bandgap structure is located on the lower dielectric board 3, and the gap 7 designed to add isolation resistance is located on the first metal layer 4 on the upper surface of the upper dielectric board 1, The structure of the filtering power dividing circuit is formed by cascading the filtering circuit and the power dividing circuit, and the total microstrip line 6 formed by the circuit is located on the lower surface of the upper dielectric board 1 . The filtering c...

Embodiment 2

[0073] Such as Figure 7 to Figure 10 As shown, the filter power divider based on the integrated substrate gap waveguide of the second embodiment has similar technical characteristics to the filter power divider based on the integrated substrate gap waveguide of the first embodiment, and the same thing is that the filtering of the two The power dividing circuits are the same in structure and size; the difference is that the shape of the gap 7 of the first metal layer 4 on the upper surface of the upper dielectric board 1 is different. The slit 7 of the filter power divider based on the integrated substrate gap waveguide of embodiment one is composed of an elliptical slit 7-1 and a rectangular slit 7-3, and the slit of the filter power divider based on the integrated substrate gap waveguide of embodiment two 7 consists of two rectangular slots 7-1 and 7-3.

[0074] The filter power divider based on the integrated substrate gap waveguide of this embodiment has the following cha...

Embodiment 3

[0078] Such as Figure 11 to Figure 16 As shown, the filter power divider based on the integrated substrate gap waveguide in the third embodiment has the same technical characteristics as the filter power divider based on the integrated substrate gap waveguide in the first embodiment, the difference is that the branch The three ladder impedances connected on both sides of the microstrip line a6 transform the ratio of the electrical length of the microstrip line to the ladder impedance, that is, the first branch and the second branch (15-1, 15-2, 16-1, 16 -2, 17-1, 17-2) have a smaller size than the filter power splitter based on the integrated substrate gap waveguide in the first embodiment.

[0079] The filter power divider based on the integrated substrate gap waveguide of this embodiment has the following characteristics in practical applications:

[0080] According to actual application requirements, the electrical lengths of the first branch and the second branch (15-1, ...

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Abstract

The invention relates to a filter power divider based on an integrated substrate gap waveguide. The power divider includes: an upper layer dielectric board, an intermediate layer dielectric board and a lower layer dielectric board that are stacked and packaged in sequence; the upper surface of the upper layer dielectric board is provided with a first metal layer, and a gap is opened on the first metal layer, and the gap is used for packaging. The isolation resistor is added to the filter power divider, and the isolation of the two output ports in the filter power divider is adjusted by adjusting the position and size of the gap; the filter power divider circuit structure is printed on the lower surface of the upper dielectric board; the filter power divider circuit The structure includes a microstrip line unit and a ladder impedance transformation structure; the ladder impedance transformation structure is set on the sixth branch microstrip line in the microstrip line unit; adjust the branch length of the ladder impedance transformation microstrip line in the ladder impedance transformation structure to adjust the filter The location of the transmission zero of the power splitter and the passband bandwidth. The invention can obtain wider bandwidth and adapt to higher frequency band.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a filter power divider based on an integrated substrate gap waveguide. Background technique [0002] In recent years, the key technology research and development of the fifth generation mobile communication system 5G has always been a focus and hot spot in the field of mobile communication research. With the large-scale application of 5G, modern communication systems have put forward higher requirements for the size of integrated circuits. Research on high-performance microwave devices with broadband, integration, and miniaturization has great engineering application value. This puts forward higher requirements for the synthesis and design of devices, and will also greatly promote the development of circuit miniaturization and integration. Both filters and power splitters are important components in microwave communication systems. In the process of pursuing miniaturization,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/16
CPCH01P5/16
Inventor 申东娅何威达
Owner YUNNAN UNIV
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