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Workpiece surface leveling device and method

A technology of leveling device and workpiece surface, which is applied in the direction of feeding device, positioning device, storage device, etc., can solve the problem of difficulty in measuring the hardness and hardness of the surface to be measured, and improve the measurement efficiency and measurement accuracy. , Save adjustment time, strong practicability effect

Active Publication Date: 2021-07-09
UNIV OF JINAN
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The levelness of the workpiece surface to be tested is affected by many factors. Before the hardness measurement, the workpiece needs to be ground and polished before the hardness measurement. During the grinding and polishing process, it is very easy to grind the surface to be tested. A certain slope, and sometimes it is necessary to measure the hardness gradient in the depth direction of the surface to be tested of a workpiece, and artificially process an inclined surface on the workpiece, resulting in a certain degree of difficulty in hardness measurement
For example, after the workpiece is cut, it is necessary to grind and polish the surface of the workpiece to be tested. During the grinding process, especially when grinding thin-walled parts, it is unavoidable that the surface to be tested of the thin-walled part will be polished to a certain extent. slope, which directly affects the measurement of the hardness of the surface to be tested

Method used

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  • Workpiece surface leveling device and method
  • Workpiece surface leveling device and method

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Embodiment Construction

[0028] Such as figure 1 As shown, the embodiment of the present invention provides an overall structural diagram of a workpiece surface leveling device for a hardness tester. The structure mainly includes the workpiece clamping system, workpiece leveling system, workpiece positioning system and workbench part.

[0029] Specifically, refer to Figure 1-Figure 3 As shown, in the embodiment of the present invention, the interior of the workbench 4 is provided with an accommodation space for placing the spring box 3. The top of the spring box 3 is open, and the workbench 4 is used to place the workpiece under test. Extend downwards on the surface and form a vertical groove 12, this vertical groove 12 communicates with the accommodating space that places spring case 3, is provided with several vertically placed springs in spring case 3, and the top of these springs A spring case cover 10 is connected on the top, and the spring case cover 10 can slide in the vertical chute 12 unde...

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Abstract

The invention relates to a workpiece surface leveling device and method, and belongs to the technical field of workpiece surface leveling. The device comprises a workbench, the workbench is provided with two clamping pieces for clamping a workpiece, the device is characterized in that the top of the workbench is provided with at least two horizontally-arranged pressing plates, the workbench is internally provided with a containing space, a vertical groove communicating with the containing space is formed in the surface of the workbench, a plurality of vertically-placed elastic pieces are arranged in the containing space, a top plate is arranged on the upper portions of the elastic pieces, the top plate can slide along the vertical groove under the elastic action of the elastic pieces and make contact with the bottom face of a workpiece, an insertion groove is formed in the side face perpendicular to the surface of the workbench, and a detachable limiting plate for fixing the top plate is arranged in the insertion groove.

Description

technical field [0001] The invention belongs to the technical field of workpiece surface leveling, and in particular relates to a workpiece surface leveling device and method. Background technique [0002] The statements herein merely provide background information related to the present invention and do not necessarily constitute prior art. [0003] In the process of hardness measurement, the levelness of the surface of the workpiece to be tested is very important, which directly affects the accuracy and accuracy of the measurement results. The levelness of the workpiece surface to be tested is affected by many factors. Before the hardness measurement, the workpiece needs to be ground and polished before the hardness measurement. During the grinding and polishing process, it is very easy to grind the surface to be tested. A certain slope, and sometimes it is necessary to measure the hardness gradient in the depth direction of the surface to be tested of a workpiece, and ar...

Claims

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Application Information

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IPC IPC(8): B21D3/10B21D43/00
CPCB21D3/10B21D43/003
Inventor 付秀丽王振达门秀花潘永智陈立文张银行
Owner UNIV OF JINAN
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