Self-rotating type heat shield rapid cleaning device and using method

Abstract

The invention discloses a self-rotating type heat shield rapid cleaning device and a using method. The device comprises a hook assembly, a first cavity, a second cavity and a third cavity; the hook assembly penetrates through one end face of the first cavity and is rotationally connected with the first cavity; the other end face of the first cavity is fixedly connected with one end face of the second cavity; the other end face of the second cavity is fixedly connected with one end face of the third cavity; the second cavity comprises an argon cavity, an exhaust cavity and a partition plate fixed between the argon cavity and the exhaust cavity; the side face of the argon cavity is fixedly connected with an air inlet valve; the exhaust cavity communicates with the third cavity; a thermoswitch control valve is fixedly connected to the partition plate, and the thermoswitch control valve is fixedly connected with a rotary exhaust passage; and a turbo type air guide disc is fixedly connected in the third cavity; and two or more exhaust holes are formed in the side face of the third cavity. By using the device, silicon powder on the inner wall of a heat shield can be cleaned up, and the influence of falling of the silicon powder on coil base crystallization during crystal pulling is avoided.

Description

technical field [0001] The invention belongs to the field of monocrystalline silicon manufacturing, and in particular relates to a spin-type heat shield rapid cleaning device and a use method. Background technique [0002] With the widespread promotion of the multi-sink process in one furnace in the single crystal industry, the number of secondary feedings in the single crystal furnace continues to increase. Since a large amount of silicon powder will be produced during the secondary feeding and adhere to the inner wall of the heat shield of the single crystal furnace, the silicon powder is easily dropped due to the influence of the air flow during crystal pulling, and when the silicon powder adheres to the crystal interface, it will cause broken edges . The existing method one is to reduce the generation of powder material when the raw material is crushed, and the other is to sieve the raw material again to remove the powder material as much as possible when adding the mat...

AI Technical Summary

Problems solved by technology

However, due to the fact that the raw material comes with powder when feeding, and the material blocks are squeezed and collided with each other, a part of the powder will be produced. The existing method cannot effectively prevent the silicon powder from adhering to the inner wall of the heat shield during feeding.

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