Automatic floor laying device capable of avoiding edge curling and unevenness
An automatic laying and leveling technology, which is applied in the direction of construction and building construction, can solve the problems of time-consuming and labor-intensive, lower heat conduction efficiency, and uncontrollable strength, so as to avoid warping or curling, reduce heat loss, and increase compactness degree of effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0022] see Figure 1-3 , an automatic floor laying device for avoiding curling and unevenness, comprising a wooden board 1, which is used for laying, the bottom end of the wooden board 1 is provided with an arc-shaped groove, and the size of the arc-shaped groove is mutually related to the size of the heating water pipe At the same time, the interior of the wooden board 1 is equipped with a heat conduction plate, which is used to transfer heat, thereby reducin...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com