Half-hole plate one-time molding processing method and printed circuit board

Abstract

The application provides a half-hole board molding processing method and a printed circuit board. The method includes steps: pretreatment, drilling, copper sinking / board electrical, outer circuit, pattern electroplating, etching, solder mask, text, surface treatment, Forming, the forming steps include one rough gong and two fine gongs. First, the circuit board is slotted through the rough gong; then the circuit board is fixed on the cardboard, and the cardboard is used to support the circuit board; Machining from the side to the right, cutting to half of the hole wall; the second fine gong is processed from the right to the left of the half hole, cutting the remaining part of the hole wall, and the path of the gong cutter for each fine gong is convex and concave. The invention cancels the semi-hole process before etching, and completes the half-hole in the forming process. The process of the half-hole is divided into coarse and two fine holes, so as to avoid burrs and burrs in the half-hole, and the circuit is fixed by the cardboard. The plate supports and protects the gong knife, and at the same time, the cardboard can be replaced automatically to save labor.

Description

technical field [0001] The invention relates to the technical field of printed circuits, in particular to a method for one-time forming of a half-hole plate and a printed circuit board. Background technique [0002] In the field of communication equipment, some printed circuit boards need to be designed as a mother board and a daughter board, which are welded together with the pins of the mother board components through the entire row of semi-metallized holes on the daughter board. Usually, the daughter board generally has a whole row or four sides. Designed as a half hole. The main difficulty in half-hole plate processing is that during the process of gong half-hole, when the rotating ground knife cuts and welds the ring, the copper layer in the hole will produce burrs and burrs, which will affect the use of the half-hole plate. [0003] At present, the main process of making half-hole plate is: adding a half-hole process between pattern electroplating and etching, after p...

AI Technical Summary

Problems solved by technology

The main defect of this method is that half-holes are formed before solder masking, hollow areas appear on the board surface, and the structural strength of the board is reduced, which increases the difficulty of solder mask silk screen printing. cost, and also affects production efficiency

In addition, in the process of semi-orifice board processing, the circuit board is thin, and the timing of the lowering and lifting of the gong knife is difficult to be accurate, and it may cut to the platform below the circuit board, causing damage to the gong knife

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