Magnetic field detection sensing device and fluxgate chip packaging structure thereof

A chip packaging structure and fluxgate technology, which is applied in the direction of magnetic field measurement, magnetic field size/direction, semiconductor/solid-state device components, etc., can solve the unfavorable development of miniaturization of magnetic sensors and the large volume of enameled wire probes, etc. question

Pending Publication Date: 2021-06-18
NINGBO CRRC TIMES TRANSDUCER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The enameled wire probe mainly includes a magnetic core and an enameled wire wound around the magnetic core. Based on this structure, the enameled wire probe has a large volume, which is not conducive to the miniaturization of the magnetic sensor.

Method used

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  • Magnetic field detection sensing device and fluxgate chip packaging structure thereof
  • Magnetic field detection sensing device and fluxgate chip packaging structure thereof

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0022] Please refer to figure 1 and figure 2 , figure 1 A schematic diagram of the assembly of the fluxgate bare chip, the conductive pins and the PCB substrate provided by the embodiment of the present invention...

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Abstract

The invention discloses a magnetic field detection sensing device and a fluxgate chip packaging structure thereof. The fluxgate chip packaging structure comprises a fluxgate bare chip, a conductive pin and a packaging layer, wherein the packaging layer wraps the peripheries of the fluxgate bare chip and the pin tail of the conductive pin; and the fluxgate bare chip is electrically connected with the pin tail. The fluxgate chip packaging structure is based on the fluxgate bare chip, a universal probe capable of being applied to a fluxgate type current sensor is formed, the fluxgate bare chip and the fluxgate type current sensor can be quickly connected through the conductive pin when the fluxgate chip packaging structure is used, and the fluxgate chip packaging structure can be matched with an internal structure of an existing fluxgate type current sensor, and is used for realizing sensor magnetic field detection; and a traditional enameled wire probe can be completely replaced, so that the size of the probe is greatly reduced.

Description

technical field [0001] The invention relates to the field of magnetic field detection, in particular to a fluxgate chip packaging structure. It also relates to a magnetic field detection and sensing device, including the fluxgate chip packaging structure. Background technique [0002] Magnetic sensor is a very important magnetic field detection sensing device, which is widely used in modern industry and electronic products to measure physical parameters such as current, position and direction by inducing magnetic field strength. [0003] One of the important structures of the magnetic sensor is the probe. At present, the probes of this magnetic sensor mostly use traditional enameled wire probes. The enameled wire probe mainly includes a magnetic core and an enameled wire wound around the magnetic core. Based on this structure, the enameled wire probe has a large volume, which is not conducive to the miniaturization of the magnetic sensor. Contents of the invention [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/49G01R33/06
CPCH01L23/31H01L23/49G01R33/06
Inventor 侯晓伟郑良广武鹏张坡朱胜平
Owner NINGBO CRRC TIMES TRANSDUCER TECH CO LTD
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