A stable crystal-bonding method for diodes

A diode and stable technology, which is applied in the field of stable die bonding of diodes, can solve the problems that the solder paste is easy to overflow around and affect the reliability of the internal structure of the diode, and achieve a coherent and reliable processing process, stable and reliable internal structure, and stable and reliable shape. Effect

Active Publication Date: 2021-09-28
先之科半导体科技(东莞)有限公司
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Problems solved by technology

[0003] SMD diodes are mainly used in microelectronic products. SMD diodes mainly include an insulating package, a chip and two pins. During production, the two pins are soldered to the two poles of the chip through solder paste, and then injected The package is processed and molded. During the die-bonding process, the solder paste adheres between the chip and the pins. Due to the effect of compression, the solder paste is easy to overflow to the surroundings, which affects the reliability of the internal structure of the diode.

Method used

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  • A stable crystal-bonding method for diodes
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  • A stable crystal-bonding method for diodes

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Embodiment Construction

[0032] In order to further understand the features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0033] refer to Figure 1 to Figure 6 .

[0034] The embodiment of the present invention discloses a stable crystal bonding method for a diode, which includes the following steps in sequence:

[0035] S1. Preheating the first jig 10, heating the first jig 10, installing the first pin 21 on the first jig 10, can effectively save processing time, and can speed up the plasticity after the subsequent dispensing operation Forming speed of conductive materials;

[0036] S2, limit compression, compress the rectangular insulating limit ring 30 on the upper surface of the first pin 21, the top surface area of ​​the first pin 21 is greater than the maximum area of ​​the insulating limit ring 30, that is, the o...

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Abstract

The invention provides a stable crystal-bonding method for a diode, which comprises the following steps: preheating the first jig; limiting and pressing, pressing the insulating limiting ring on the upper surface of the first pin; once spraying, insulating limiting The inner wall of the bit ring forms the first particle layer; glue is dispensed at one time; the chip is attached, and the chip is pressed against the plastic conductive material on the first pin; the limit moves upward, and the first particle layer adheres to the first molding around the layer; first curing; second spraying, the inner wall of the insulating limit ring forms a second particle layer; second dispensing; sticking the top pin, pressing the second pin on the insulating limit ring; ring separation, the second The second particle layer is adhered to the surrounding of the second shaping layer; secondary curing. The invention can effectively limit the shapeable conductive material through the insulating limit ring, and the particle layer formed by the conductive particles can ensure the stable and reliable shape of the plastic layer before curing, and the finally obtained internal structure of the diode is stable and reliable.

Description

technical field [0001] The invention relates to diode processing, and specifically discloses a stable crystal-fixing method for diodes. Background technique [0002] When a forward bias voltage is applied, the diode forms a conduction effect, and when the actual reverse bias voltage is applied, the diode forms a blocking effect. The packaging of the diode includes an in-line packaging structure and a chip packaging structure. [0003] SMD diodes are mainly used in microelectronic products. SMD diodes mainly include an insulating package, a chip and two pins. During production, the two pins are soldered to the two poles of the chip through solder paste, and then injected The package is processed and molded. During the die-bonding process, the solder paste adheres between the chip and the pins. Due to the effect of compression, the solder paste is easy to overflow to the surroundings, which affects the reliability of the internal structure of the diode. Contents of the inven...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L29/861H01L23/49
CPCH01L21/561H01L29/861H01L23/49H01L2224/33181H01L2224/32245
Inventor 黄景扬
Owner 先之科半导体科技(东莞)有限公司
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