Terminal active heat dissipation device and method, terminal and readable storage medium
A technology of active heat dissipation and drive device, applied in instrumentation, error detection/correction, calculation, etc., can solve problems such as affecting user experience, limited heat dissipation method, and increased terminal power consumption, etc., to improve dustproof and waterproof performance, The effect of reducing the appearance of the product and reducing the size of the body
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Embodiment 1
[0038] In order to solve the problem in the related art that the terminal uses a built-in metal heat sink, and a large number of heat dissipation holes are set on the housing to dissipate heat, resulting in a large terminal volume, affecting the terminal appearance design, and being easily invaded by dust and water vapor, the embodiment of the present invention provides A terminal active cooling device is proposed.
[0039] The terminal active cooling device in this embodiment can be applied to various electronic terminals, including various mobile terminals, such as mobile phones, tablets, palmtop computers or notebook computers, etc.; it can also be used on non-mobile terminals, such as desktop computers Wait. The terminal active cooling device provided in this embodiment includes a cooling fin assembly and a driving device. The driving device is connected with the heat sink assembly, and is used to control the heat sink assembly to extend a preset distance to the outside o...
Embodiment 2
[0058] In order to solve the problem in the related art that the terminal uses a built-in metal heat sink, and a large number of heat dissipation holes are set on the housing to dissipate heat, resulting in a large terminal volume, affecting the terminal appearance design, and being easily invaded by dust and water vapor, the embodiment of the present invention provides A terminal active heat dissipation method is provided, which is applied to any terminal active heat dissipation device in Embodiment 1.
[0059] See Figure 7 , a terminal active heat dissipation method provided by an embodiment of the present invention includes:
[0060] S701: Obtain the internal temperature of the terminal through a temperature sensor.
[0061] The sensor is arranged inside the terminal and is used to acquire the internal temperature of the terminal. The location where the sensor is set can be adjusted according to the actual situation, for example, it is set near a processor that generates...
Embodiment 3
[0078] This embodiment also provides a terminal, see Figure 9 As shown, it includes a processor 91, a memory 92, and a communication bus 93, and also includes a terminal active cooling device 94 in Embodiment 1, wherein:
[0079] The communication bus 93 is used to realize the connection and communication between the processor 91 and the memory 92, and realize the connection and communication between the processor 91 and the terminal active cooling device 94;
[0080] The processor 91 is configured to execute one or more computer programs stored in the memory 92, so as to implement at least one step in the method for actively dissipating heat from a terminal in the second embodiment above.
[0081] The present embodiment also provides a computer-readable storage medium, which includes information implemented in any method or technology for storing information, such as computer-readable instructions, data structures, computer program modules, or other data. volatile or nonvol...
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