Terminal active heat dissipation device and method, terminal and readable storage medium

Abstract

According to the terminal active heat dissipation device and method, the terminal and the readable storage medium, the movable shell is arranged on the terminal, and the cooling fins are fixed to the inner side of the movable shell; when the internal temperature of the terminal is larger than the first preset condition, the driving device is started, the movable shell and the cooling fins fixed on the inner side of the movable shell are ejected out of the terminal by a preset distance, and the cooling fins are used for radiation heat dissipation; when the internal temperature of the terminal is smaller than a second preset condition, the driving device is started, and the movable shell and the cooling fins fixed on the inner side of the movable shell are withdrawn and reset; in some implementation processes, the invention has, but not limited to, the technical effects of improving the heat dissipation efficiency of the terminal, improving the dustproof and waterproof performance of the terminal, reducing the size of a terminal body and reducing the influence on the appearance of a product.

Description

technical field [0001] Embodiments of the present invention relate to but are not limited to the field of terminal heat dissipation, and in particular, relate to but are not limited to a terminal active heat dissipation device, method, terminal, and readable storage medium. Background technique [0002] Good heat dissipation performance has always been an important performance index of many terminals. At present, the heat dissipation methods used by terminal products include air cooling, water cooling, heat pipes, metal heat sinks, thermal pads, thermal gel, graphite sheets, etc. In the 4G era, the transmission rate is low and the power consumption is relatively low, so traditional cooling solutions are sufficient. [0003] With the advent of the 5G era, various 5G terminals have begun to serve people's lives. The high speed and low latency of 5G technology have led to a significant increase in power consumption of terminals. In addition, as various terminals such as compute...

AI Technical Summary

Problems solved by technology

In the 4G era, the transmission rate is low, the power consumption is relatively low, and the traditional heat dissipation scheme is sufficient to deal with

[0003] With the advent of the 5G era, various 5G terminals have begun to serve people's lives. The high speed and low latency of 5G technology have led to a significant increase in power consumption of terminals. In addition, as various terminals such as computers and mobile phones The improvement of performance, the increasing heat output, and the increasing miniaturization of terminal products make the traditional heat dissipation methods more limited. For example, air cooling is the most widely used, and fans need to be installed inside the product, resulting in power consumption. , noise and other issues, the heat dissipation effect is also closely related to the use environment; water cooling or oil cooling needs to be equipped with a liquid circulation device and a liquid cooling system, which takes up a lot of space and is generally not suitable for small portable terminal equipment; the cost of heat pipes is high, and in practical applications The cooling effect is debatable; heat conduction pads, heat conduction gels, graphite sheets, etc. can disperse the heat from concentrated chips and other areas or conduct it to other non-heating areas. For the situation where there are many heat dissipation points and the temperature of the whole machine is very high, the skill is limited.

[0004] In related technologies, most terminal products use built-in metal heat sinks to dissipate heat. Some terminal products have extremely high power consumption and high heat generation, so they need built-in larger heat sinks to achieve a more suitable heat dissipation effect, which is not conducive to terminals. The miniaturization of the product affects the user experience. At the same time, it is necessary to open a large number of cooling holes on the shell to dissipate the heat, which affects the appearance design of the product and is not conducive to marketing. On the one hand, the cooling holes affect the appearance of the product, and on the other hand, they also bring dust Problems with water vapor intrusion etc.

Images