Micro LED chip mass transfer method and display backboard

A transfer method and chip transfer technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of position deviation, difficult and effective electrical connection of MicroLED chips, etc., and achieve effective electrical connection, high-precision mass transfer, high The effect of efficiency

Active Publication Date: 2021-06-15
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Mass transfer requires extremely high precision. If you are not careful, the position of the Micro LED chip will be shifted when it is bound to the li

Method used

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  • Micro LED chip mass transfer method and display backboard
  • Micro LED chip mass transfer method and display backboard
  • Micro LED chip mass transfer method and display backboard

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Embodiment Construction

[0066] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0067] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right" etc. are based on The orientations or positional relationships shown in the drawings are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred devices or components must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as Limitat...

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Abstract

The invention provides a micro LED chip mass transfer method and a display backboard. According to the Micro LED chip mass transfer method and the display backboard, an insulation expansion gasket is arranged in a chip installation groove; a Micro LED chip is transferred to the insulation expansion gasket; the insulation expansion gasket is controlled to expand regularly through heating, so that alignment of the Micro LED chip is achieved, high-precision mass transfer can be achieved with high efficiency, and effective electric connection between the Micro LED chip and a light-emitting substrate can be ensured. In the process that the Micro LED chip is placed in the chip installation groove, the falling point position of the Micro LED chip does not need to be strictly controlled, only a first chip electrode and a second chip electrode need to be located on the two sides of the insulation expansion gasket respectively, then the insulation expansion gasket is controlled to be expanded regularly through heating, and alignment of the Micro LED chip can be achieved; and at the moment, pre-binding and curing operations are further carried out, so that effective electric connection between the Micro LED chip and the light-emitting substrate can be ensured at low cost.

Description

technical field [0001] The present invention relates to the fields of semiconductor preparation equipment and light-emitting diode preparation equipment, relates to a method for mass transfer of Micro LED chips, and also relates to a display backplane produced by the above method. Background technique [0002] LED, that is, light-emitting diode, emits energy through the recombination of electrons and holes, and can efficiently convert electrical energy into light energy. It has many advantages and is considered to be the next generation of new solid-state light sources entering the field of general lighting. Micro LED is a new type of LED. Because of its many advantages such as fast response, high brightness, and low power consumption, it has high research and development value and use value. It has recently been welcomed by the market and favored by various manufacturers. [0003] In practical applications, a display backplane is composed of multiple Micro LED chips and a l...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/62H01L25/13
CPCH01L33/483H01L33/62H01L25/13H01L2933/0033H01L2933/0066
Inventor 李强许时渊
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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