Micro LED chip mass transfer method and display backboard

Abstract

The invention provides a micro LED chip mass transfer method and a display backboard. According to the Micro LED chip mass transfer method and the display backboard, an insulation expansion gasket is arranged in a chip installation groove; a Micro LED chip is transferred to the insulation expansion gasket; the insulation expansion gasket is controlled to expand regularly through heating, so that alignment of the Micro LED chip is achieved, high-precision mass transfer can be achieved with high efficiency, and effective electric connection between the Micro LED chip and a light-emitting substrate can be ensured. In the process that the Micro LED chip is placed in the chip installation groove, the falling point position of the Micro LED chip does not need to be strictly controlled, only a first chip electrode and a second chip electrode need to be located on the two sides of the insulation expansion gasket respectively, then the insulation expansion gasket is controlled to be expanded regularly through heating, and alignment of the Micro LED chip can be achieved; and at the moment, pre-binding and curing operations are further carried out, so that effective electric connection between the Micro LED chip and the light-emitting substrate can be ensured at low cost.

Description

technical field [0001] The present invention relates to the fields of semiconductor preparation equipment and light-emitting diode preparation equipment, relates to a method for mass transfer of Micro LED chips, and also relates to a display backplane produced by the above method. Background technique [0002] LED, that is, light-emitting diode, emits energy through the recombination of electrons and holes, and can efficiently convert electrical energy into light energy. It has many advantages and is considered to be the next generation of new solid-state light sources entering the field of general lighting. Micro LED is a new type of LED. Because of its many advantages such as fast response, high brightness, and low power consumption, it has high research and development value and use value. It has recently been welcomed by the market and favored by various manufacturers. [0003] In practical applications, a display backplane is composed of multiple Micro LED chips and a l...

AI Technical Summary

Problems solved by technology

Mass transfer requires extremely high precision. If you are not careful, the position of the Micro LED chip will be shifted when it is bound to the light-emitting substrate, making it difficult to achieve an effective electrical connection between the Micro LED chip and the light-emitting substrate.

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