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Chip packaging device for integrated circuit

A chip packaging and integrated circuit technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., to achieve the effect of fastening packaging devices

Pending Publication Date: 2021-06-15
刘丽婵
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies in the use of the existing chip packaging proposed in the background technology, the present invention provides a chip packaging device for integrated circuits and its fixing method, which has the advantages of rapid heat dissipation and vibration mitigation, and solves the above background technical issues raised in technology

Method used

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  • Chip packaging device for integrated circuit
  • Chip packaging device for integrated circuit
  • Chip packaging device for integrated circuit

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] see Figure 1-3 , a chip packaging device for integrated circuits, comprising a circuit board 1, a base 15 is fixedly connected to the upper surface of the circuit board 1, a chip 2 is placed in the middle of the base 15, and a conductive sheet 3 is movably connected to the upper surface of the chip 2, One end of the middle part of the conductive sheet 3 is fixedly connected with a P-type semiconductor 4, the other end of the middle part of the conducti...

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Abstract

The invention relates to the technical field of chip packaging, and discloses a chip packaging device for an integrated circuit. The chip packaging device comprises a circuit board, wherein the upper surface of the circuit board is fixedly connected with a base, a chip is placed in the middle of the base, the upper surface of the chip is movably connected with a conducting strip, one end of the middle of the conducting strip is fixedly connected with a P-type semiconductor, the other end of the middle of the conducting strip is fixedly connected with an N-type semiconductor, the upper surface of the conducting strip is fixedly connected with a heat release plate, and the base and the heat release plate are both made of an insulating ceramic material. According to the invention, a rapid heat dissipation mechanism is arranged, so that when the chip works normally, the N-type semiconductor and the P-type semiconductor in the packaging device can enable the base made of the insulating ceramic material to absorb heat of the chip under the conduction effect through the Peltier effect, heat generated when the chip works is rapidly absorbed, and then it is guaranteed that the temperature of the chip during working is not too high.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a chip packaging device for integrated circuits. Background technique [0002] The shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance. It is also a bridge to communicate the internal world of the chip and the external circuit. The contacts on the chip are connected to the leads of the package shell by wires. These pins are connected to other devices through wires on the printed board. [0003] The chip packaging of traditional integrated circuits is mainly used to isolate the chip from the air and prevent impurities in the air from corroding the chip, thereby affecting the working life of the chip. It is conducive to the dissipation of heat from the chip, causing the chip to burn out due to overheating after a long time of use, and the internal chip pa...

Claims

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Application Information

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IPC IPC(8): H01L23/38H01L23/16H01L23/31
CPCH01L23/16H01L23/3107H01L23/38
Inventor 刘丽婵
Owner 刘丽婵
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