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Modular multilevel converter (MMC) five-level clamping sub-module topological structure

A modular multi-level, topological structure technology, applied in the direction of converting AC power input to DC power output, electrical components, circuit devices, etc., can solve the problems of large amount of calculation, large switching loss of power devices, etc., and achieve the elimination of DC faults , voltage equalization, reducing hardware cost and the effect of controller calculation

Active Publication Date: 2021-06-11
KUNMING UNIV OF SCI & TECH
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional sub-module capacitor voltage sorting algorithm has a large amount of calculation, and the switching loss of power devices is large. The voltage equalization sorting algorithm needs to monitor all sub-module capacitors

Method used

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  • Modular multilevel converter (MMC) five-level clamping sub-module topological structure
  • Modular multilevel converter (MMC) five-level clamping sub-module topological structure
  • Modular multilevel converter (MMC) five-level clamping sub-module topological structure

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Embodiment Construction

[0057] The present invention will be further described below in combination with the accompanying drawings and specific embodiments.

[0058] Such as figure 2 As shown, a modular multilevel converter MMC five-level clamping sub-module topology, including A, B, C three-phase circuits composed of sub-modules, each phase includes two upper and lower bridge arms, each bridge The arm is composed of N sub-modules, and there are two bridge arm reactors between the upper and lower bridge arms of the A, B, and C three-phase circuits. Each bridge arm of the entire MMC topology has N five-level clamping sub-modules, a total of 9N IGBTs, 9N+1 diodes, and 4N capacitors.

[0059] The upper output end of the first sub-module of the upper bridge arm of the A-phase circuit is connected to the positive pole of the DC bus, the lower output end is connected to the upper output end of the second sub-module, and the upper output end of the second sub-module is connected to the lower end of the fi...

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Abstract

The invention relates to a modular multilevel converter (MMC) five-level clamping sub-module topological structure, and belongs to the technical field of flexible direct current transmission. The structure comprises an A-phase circuit, a B-phase circuit and a C-phase circuit which are composed of sub-modules, wherein each phase comprises an upper bridge arm and a lower bridge arm, each bridge arm is composed of N sub-modules, and two bridge arm reactors exist between the upper bridge arms and the lower bridge arms of the A-phase circuit, the B-phase circuit and the C-phase circuit; and each sub-module comprises a sub-module upper half part and a sub-module lower half part which are connected through a diode, a voltage negative electrode port of the sub-module upper half part is connected to a voltage positive electrode port of the sub-module lower half part, a voltage negative electrode port of the sub-module lower half part is connected with an anode of the diode, and the upper half part of the sub-module is connected with a cathode of the diode. The MMC five-level clamping sub-module topological structure has good DC fault clearing capability and good voltage sharing effect, and is beneficial to rapid restart of an MMC.

Description

technical field [0001] The invention relates to a topological structure of a modular multilevel converter MMC five-level clamping sub-module, in particular to a topology structure of a modular multi-level converter MMC five-level clamping sub-module with the function of clearing DC faults , belonging to the technical field of flexible direct current transmission. Background technique [0002] Due to its modular structure, the modular multilevel converter has the advantages of easy expansion, good output waveform quality, comprehensive fault protection, strong recovery ability, low loss and strong unbalanced operation ability, etc., and is widely used in high-voltage direct current transmission field. The modular multilevel converter topology based on the half-bridge sub-module is one of the voltage source converter topologies with great technical advantages. Ease of expansion, high quality voltage and current output waveforms, low harmonic content, no need for dynamic volt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M7/487H02M1/32H02H7/122H02H3/087
CPCH02M7/487H02M1/32H02H7/122H02H3/087
Inventor 江耀曦束洪春邵宗学杨竞及田鑫萃
Owner KUNMING UNIV OF SCI & TECH
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