Rapid bonding equipment and method for gasket of flexible printed circuit of inductor

A bonding equipment and sensor technology, applied in chemical instruments and methods, metal processing equipment, lamination devices, etc., can solve the problems of slow bonding speed, small size of sponge gasket, and inability to guarantee the bonding quality, etc., to achieve Enhance the lamination effect, save lamination time, and accelerate the effect of drying and curing

Active Publication Date: 2021-06-08
深圳市磐锋精密技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to make up for the deficiencies of the existing technology, when the sponge gasket is placed on the sensor cable, manual lamination is generally used. However, due to the small size of the sponge gasket itself, tweezers and pressing sheets are generally used for operation. , the bonding speed is slow, and the bonding quality cannot be guaranteed. The present invention proposes a fast bonding device and bonding method for sensor cable gaskets

Method used

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  • Rapid bonding equipment and method for gasket of flexible printed circuit of inductor
  • Rapid bonding equipment and method for gasket of flexible printed circuit of inductor
  • Rapid bonding equipment and method for gasket of flexible printed circuit of inductor

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Embodiment approach

[0034] As an embodiment of the present invention, the first connecting post 14 is covered with a first spring 141, and the top end of the first connecting post 14 extends through the housing 1 into the first cavity 12; the first spring One end of 141 is affixed to the bottom of the housing 1, and the other end is affixed to the top of the suction cup 16; the side wall of the housing 1 is hinged with a bracket 2, and the hinge point is provided with a torsion spring; the bottom of the bracket 2 Both side walls are rotatably connected with a first rotating shaft 21; a pair of first rotating shafts 21 are fixedly connected with a pressure wheel 22; during work, after the sucker 16 absorbs the sponge gasket and fits it, press down Housing 1, at this time the first connecting column 14 shrinks under the action of the first spring 141, at this time the pressure wheel 22 is in contact with the sponge gasket, and the housing 1 continues to be pressed down, at this time the pressure whe...

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Abstract

The invention belongs to the technical field of gasket bonding, and particularly relates to rapid rapid bonding equipment and method for a gasket of a flexible printed circuit of an inductor. The equipment comprises a shell, wherein a battery cavity and a first cavity are arranged in the shell; the battery cavity is arranged right above the first cavity; a switch piece is arranged at the top end of the shell; a first connecting column is arranged at the bottom end of the shell; a first through hole is arranged in the first connecting column; the bottom end of the first connecting column is fixedly connected to a suction cup; a second cavity is arranged in the suction cup; air suction holes are arranged in the bottom end and the side wall of the suction cup; and the first through hole, the first cavity and the air suction holes are in a communicated state. The rapid bonding equipment and method for the gasket of the flexible printed circuit of the inductor solve the problems that when a sponge gasket is bonded on the flexible printed circuit of the inductor, manual bonding is generally adopted, but the bonding speed is slow and the bonding quality cannot be ensured due to the fact that the sponge gasket is small in size and generally operated by tweezers and a pressing sheet.

Description

technical field [0001] The invention belongs to the technical field of gaskets, and in particular relates to a fast lamination device and a lamination method for sensor wiring gaskets. Background technique [0002] Cable, also called flexible printed circuit board (FPC). It is used for data transmission in moving parts and active areas, such as the data cable connecting the internal motherboard of a computer to a hard disk and an optical drive, and connecting the motherboard of a mobile phone to a display screen in accordance with the industry standards for wiring rules, line sequence, line color, and line number, etc. Data cables, as well as data cables connecting devices are collectively referred to as flat cables. The sponge pads for the cables are mainly used for positioning and shock absorption. Without the sponge pads, the device cannot be shaken or dropped, otherwise there is a risk of the cables loosening or breaking. [0003] In the prior art, there are also some ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P19/00B32B37/12
CPCB23P19/00B32B37/1284
Inventor 欧文灏徐思通鲁伟赵阳李文科
Owner 深圳市磐锋精密技术有限公司
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