Copper foil gluing and rolling integrated equipment and implementation mode

A technology of gluing and copper foil, which is applied to the device, coating, pretreatment surface, etc. of coating liquid on the surface, which can solve the problems of affecting the production quality of copper foil, colloid dripping, and uneven brushing.

Active Publication Date: 2021-06-08
赣州逸豪新材料股份有限公司
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0003] The current copper foil gluing and winding equipment, after the gluing is completed, must carry out the drying operation of the colloid. Drying in time will affect the production quality of copper foil, and because the copper foil is a flat structure in the process of glue application, the problem of colloid dripping will easily occur if the glue is too thick

Method used

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  • Copper foil gluing and rolling integrated equipment and implementation mode
  • Copper foil gluing and rolling integrated equipment and implementation mode
  • Copper foil gluing and rolling integrated equipment and implementation mode

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Embodiment approach ， 1 1 Embodiment approach

[0038] In order to further and better explain the above-mentioned embodiments, the present invention also provides an embodiment, an embodiment of an integrated copper foil gluing and winding device, which includes the following steps:

[0039] Step 1: Fix the copper foil component 12 and the colloid component 13 on the side of the inner cavity of the box body 11 by clamping the telescopic rod 112, and then clamp the copper foil component 12 and the colloid component 13 at the winding port by the traction block 223 During the clamping and traction process, the copper foil assembly 12 and the colloid assembly 13 are respectively guided by the second guide roller 114 and the first guide roller 113, and cooperate with the repressing roller set 115 to keep the copper foil assembly 12 horizontal state, the colloid assembly 13 remains in a tilted state;

[0040] Step 2: While the colloid assembly 13 is kept in a tilted state, the bottom surface of the filling layer 132 is in contact...

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Abstract

The invention discloses copper foil gluing and rolling integrated equipment which comprises a gluing mechanism and a rolling mechanism, the rolling mechanism is arranged on one side of the gluing mechanism, a packaging layer is arranged on the surface of a filling layer, isolation blocks are arranged on the two sides of the bottom face of the filling layer, a filling cavity is formed in the filling layer, glue is arranged in the filling cavity, the packaging layer and the filling layer are components made of paper materials, anti-sticking coatings are arranged on the surfaces of the packaging layer and the filling layer, a traditional barreled glue brushing process is replaced, when the bottom of the filling layer is scratched through a tool bit in the copper foil rolling process, glue in the filling cavity flows to the surface of a copper foil roll through a discharging opening, a brush head is matched for brushing operation, a colloid assembly is matched for synchronous sealed rolling, the drying process in the rolling process is simplified, when copper foil is rolled into a rolling bin, a hot air fan can be matched with a heating cavity and a communicating cavity, rolling and drying are conducted synchronously, and the rolling efficiency of the copper foil is improved.

Description

technical field [0001] The invention relates to the technical field of copper foil gluing and winding, in particular to an integrated equipment for copper foil gluing and winding and its implementation. Background technique [0002] Copper foil has low surface oxygen characteristics, and can be attached to various substrates, such as metals, insulating materials, etc., and has a wide temperature range. It is mainly used in electromagnetic shielding and antistatic, and conductive copper foil is placed on the substrate surface. Combined with metal substrate, it has excellent conductivity and provides electromagnetic shielding effect. It can be divided into: self-adhesive copper foil, double-lead copper foil, single-lead copper foil, etc. Electronic grade copper foil is one of the basic materials of the electronics industry. With the rapid development of the electronic information industry, the use of electronic grade copper foil is increasing. Products are widely used in indu...

Claims

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Application Information

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IPC IPC(8): B05C5/02B05C9/14B05C11/02B05C11/11B05C13/02B05D3/04
CPCB05C5/0245B05C9/14B05C11/023B05C11/11B05C13/02B05D3/0413
Inventor 陆峰刘磊周席黎少华李彦坤胡华发
Owner 赣州逸豪新材料股份有限公司
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