Thick copper backboard and manufacturing method thereof

Abstract

The invention belongs to the technical field of printed circuit board manufacturing, and discloses a thick copper backboard and a manufacturing method thereof. The method comprises the steps: etching a circuit on a thick copper layer core board of which the inner layer copper thickness is greater than or equal to 105 microns m in advance; pressing the thick copper layer core board for the first time; according to the expansion and shrinkage data of the laminated thick copper core board, obtaining pre-release expansion and shrinkage of other layers of core boards, and etching lines of other layers of core boards; and pressing a required PCB structure together. According to the invention, the thick copper layer core board is firstly pressed for one time so that a glue filling amount in a pressing process is reduced, the slippage of the pressed core board caused by the excessive glue filling amount in the pressing process is avoided, and the requirement on the distance from the hole to the inner layer pattern can be reduced; the thick copper layer core board is firstly pressed for one time so that interlayer holes caused by the too much filling glue due to too large thickness of interlayer copper during pressing can be reduced; meanwhile, the manufacturing process is simple, the percent of pass is high, and manufacturing of the backboard with the inner layer copper thickness larger than 105 microns can be achieved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board manufacturing, and in particular relates to a thick copper backboard and a manufacturing method thereof. Background technique [0002] At present, in modern communication equipment, the backplane provides electrical interconnection between modules in the same equipment. With the development of technology and the stimulation of users' demand for bandwidth, the data link rate between the line card and the switch card in the communication equipment Higher and higher. Therefore, when designing, the wiring density of the backplane is getting higher and higher, and the signal transmission rate is getting higher and higher. However, the conventional backplane is usually only composed of PCB and connectors. At present, a new technology backplane composed of PCB, connectors and control chips has emerged, which can control the signal transmission of the connectors through the chip. This type...

AI Technical Summary

Problems solved by technology

[0010] Through the above analysis, the problems and defects of the existing technology are: when the existing backplane manufacturing process is used to manufacture thick copper backplanes, the problem of high scrap rate often occurs, especially the metallized via holes and The short circuit of the inner layer conductor accounts for more than 90% of scrapping

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