Winding type material collection device for lead frame production and working method of winding type material collection device

Abstract

The invention discloses a winding type material collection device for lead frame production and a working method of the winding type material collection device. The winding type material collection device comprises a material collection mechanism; the material collection mechanism comprises a material collection box; a through opening is formed in the middle of one side of the material collection box; the two ends of the inner wall of the material collection box are fixedly connected with abutting and pushing air cylinders; and the output ends of the two abutting and pushing air cylinders are fixedly connected with abutting and pushing plates. The middle portion of one side of each of the two abutting and pushing plates is fixedly connected with an abutting and pushing spring, one end of each of the two abutting and pushing springs is fixedly connected with an arc-shaped pressing plate, and the two ends of one side of each of the two arc-shaped pressing plates are fixedly connected with side springs. According to the winding type material collection device for lead frame production and the working method of the winding type material collection device, the influence of the external environment on a lead frame can be effectively avoided, meanwhile, the lead frame in a material arranging box is pushed in an abutting mode, the tensioning state of the lead frame is maintained, bending and overturning of the lead frame are avoided, and normal operation of winding operation is guaranteed.

Description

technical field [0001] The invention relates to the technical field of lead frame production, in particular to a winding-type material receiving device for lead frame production and a working method thereof. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the external lead by means of a bonding material, forming an electrical circuit. It acts as a bridge connecting the external wire. Most of the semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] The main material for producing lead frame is copper alloy. Take the copper alloy sheet and punch it through the convex and concave dies of the punching die to form a semi-finished lead frame to realize the production of high-density and multi-pin lead frame. The lead frame mat...

AI Technical Summary

Problems solved by technology

When the redundant section of the existing winding device is not collected, it is often in a state of natural prolapse, scattered and stacked in the equipment working area, which is easily damaged by the external environment, and at the same time brings certain inconvenience to the personnel in the working area. At the same time, the stacked lead frames are prone to bending and folding, which brings some inconvenience to the winding operation; and the existing winding device needs to manually pull the end head through a large number of equipment mechanisms when winding the lead frame of the new section. Then connect with the winding device, it is more inconvenient to use

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