Wafer glass powder wiping device

Abstract

The utility model discloses a wafer glass powder wiping device, and belongs to the technical field of wafer processing auxiliary equipment. The wafer clamping device is characterized in that a pressurizing device is installed on a reciprocating motion device and reciprocates along with the reciprocating motion device, a pressing part is arranged at the bottom of the pressurizing device, a tray (15) is arranged below the pressing part, and an adsorption part used for fixing a wafer is arranged on the tray (15). According to the pressurizing device of the wafer glass powder wiping device, the wafer is pressed through the pressing part, kraft paper is placed on the pressing part, the reciprocating motion device drives the pressurizing device to do reciprocating motion, the pressing part and the wafer achieve relative motion so that glass powder on the wafer can be wiped, the wafer can be firmly sucked through the suction part on the tray, the wafer is prevented from moving along with the pressing part, the pressurizing device can ensure that the pressure of the pressing plate on the wafer is constant, the thickness of glass powder on the wiped wafer is uniform, the wafer wiping speed is high, the thickness of the glass powder is uniform, and the qualified rate of machined chips is high.

Description

technical field [0001] A wafer glass powder wiping device belongs to the technical field of wafer processing auxiliary equipment. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and becomes an integrated circuit with specific electrical functions. circuit products. In the process of producing electronic components from wafers, glass powder needs to be coated on the wafers to ensure that a protective glass layer can be formed on the sides of the chips after dicing. [0003] It is difficult to ensure that the glass powder is evenly applied when the glass powder is painted on the wafer, that is, the thickness of the glass powder at different positions on the wafer is different, which will affect the subsequent processing steps of the wafer, and then affect the ...

AI Technical Summary

Problems solved by technology

In the process of wiping the glass powder on the wafer, the pressure on the wafer must be kept constant to ensure that the thickness of the glass powder on the wafer is uniform. At present, only workers can wipe the wafer, but manual wiping is very difficult. Difficult to ensure a constant pressure, difficult to ensure the quality of wiping, that is, the thickness of the glass frit after wiping is still difficult to ensure uniform

At present, the above problems cannot be solved in the industry, and this technical problem has greatly affected the pass rate of chip production

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