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Semiconductor process equipment and air inlet mechanism thereof

A technology of air intake mechanism and process equipment, which is applied to electrical components, discharge tubes, circuits, etc., can solve the problems of poor uniformity, poor film formation quality of wafers, uneven air intake of air intake mechanism, etc. Effects of Film Uniformity and Yield

Pending Publication Date: 2021-05-28
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the existing methods, the present application proposes a semiconductor process equipment and its air intake mechanism to solve the problem of poor film quality and poor uniformity of wafer film formation in the prior art due to uneven air intake of the air intake mechanism question

Method used

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  • Semiconductor process equipment and air inlet mechanism thereof
  • Semiconductor process equipment and air inlet mechanism thereof
  • Semiconductor process equipment and air inlet mechanism thereof

Examples

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Embodiment Construction

[0027] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0028] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

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Abstract

The embodiment of the invention provides semiconductor process equipment and an air inlet mechanism thereof. The air inlet mechanism comprises an air inlet supporting piece, a flow uniformizing cover and a plurality of adjusting pieces. The air inlet supporting piece is used for being arranged at the top of a process chamber, the flow uniformizing cover is arranged in the air inlet supporting piece, an annular flow uniformizing cavity is formed between the air inlet supporting piece and the flow uniformizing cover, the air inlet supporting piece is provided with an air inlet channel communicated with the flow uniformizing cavity, and the air inlet channel is used for guiding in air; a plurality of air inlet holes distributed at intervals in the circumferential direction are formed in the flow uniformizing cover, and the flow uniformizing cavity is communicated with a process cavity of the process chamber through the air inlet holes; a flange extending in the circumferential direction is arranged on the outer circumferential wall of the flow uniformizing cover and located at the bottoms of the multiple air inlet holes. The multiple adjusting pieces are movably arranged on the flange and correspond to the multiple air inlet holes respectively, and the adjusting pieces are used for adjusting the flow of air entering the air inlet holes from the flow uniformizing cavity. According to the embodiment of the invention, uniform air inlet of the process chamber is realized, and the film forming uniformity and yield of wafers are greatly improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor processing, and in particular, the present application relates to a semiconductor process equipment and an air intake mechanism thereof. Background technique [0002] At present, semiconductor memory is one of the most important technologies in the integrated circuit industry. It is widely used in various fields of information, social security, aviation / aerospace, military / defense, new energy and scientific research, and is an important manifestation of national competitiveness. With the rise of technologies such as big data, cloud computing, and the Internet of Things, the information that needs to be stored and analyzed is exploding, so there is a huge market for memory. The air intake mechanism generally used in semiconductor process equipment in the prior art includes a uniform flow cover, which is sleeved in the process chamber and surrounds the base in the process chamber to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32
CPCH01J37/32449
Inventor 李新颖王宽冒
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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